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STU40N2LH5 PDF预览

STU40N2LH5

更新时间: 2024-11-02 06:14:51
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
15页 920K
描述
N-channel 25V, 0.01 OHM, 40A, DPAK, IPAK STripFET V Power MOSFET

STU40N2LH5 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-251
包装说明:ROHS COMPLIANT, IPAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.82雪崩能效等级(Eas):110 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:25 V最大漏极电流 (Abs) (ID):40 A
最大漏极电流 (ID):40 A最大漏源导通电阻:0.0161 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-251
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):35 W最大脉冲漏极电流 (IDM):160 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn) - annealed
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

STU40N2LH5 数据手册

 浏览型号STU40N2LH5的Datasheet PDF文件第2页浏览型号STU40N2LH5的Datasheet PDF文件第3页浏览型号STU40N2LH5的Datasheet PDF文件第4页浏览型号STU40N2LH5的Datasheet PDF文件第5页浏览型号STU40N2LH5的Datasheet PDF文件第6页浏览型号STU40N2LH5的Datasheet PDF文件第7页 
STD40N2LH5  
STU40N2LH5  
N-channel 25 V, 0.01 , 40 A, DPAK, IPAK  
STripFET™ V Power MOSFET  
Features  
Type  
VDSS  
RDS(on) max  
ID  
STD40N2LH5  
STU40N2LH5  
25 V  
25 V  
0.0118 Ω  
0.0124 Ω  
40 A  
40 A  
3
3
2
R  
* Q industry benchmark  
g
1
DS(on)  
1
Extremely low on-resistance R  
DS(on)  
DPAK  
IPAK  
Very low switching gate charge  
High avalanche ruggedness  
Low gate drive power losses  
Application  
Switching applications  
Figure 1.  
Internal schematic diagram  
Description  
This STripFET™ V Power MOSFET technology  
is among the latest improvements, which have  
been especially tailored to achieve very low on-  
state resistance providing also one of the best-in-  
class figure of merit (FOM).  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
DPAK  
IPAK  
Packaging  
STD40N2LH5  
STU40N2LH5  
40N2LH5  
40N2LH5  
Tape and reel  
Tube  
September 2009  
Doc ID 14919 Rev 3  
1/15  
www.st.com  
15  

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