是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TO-247 | 包装说明: | ROHS COMPLIANT PACKAGE-3 |
针数: | 3 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | 风险等级: | 5.68 |
Is Samacsys: | N | 最大集电极电流 (IC): | 80 A |
集电极-发射极最大电压: | 600 V | 配置: | SINGLE WITH BUILT-IN DIODE |
门极发射器阈值电压最大值: | 5.75 V | 门极-发射极最大电压: | 20 V |
JEDEC-95代码: | TO-247 | JESD-30 代码: | R-PSFM-T3 |
JESD-609代码: | e3 | 元件数量: | 1 |
端子数量: | 3 | 最高工作温度: | 150 °C |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | NOT SPECIFIED |
极性/信道类型: | N-CHANNEL | 最大功率耗散 (Abs): | 310 W |
认证状态: | Not Qualified | 子类别: | Insulated Gate BIP Transistors |
表面贴装: | NO | 端子面层: | Tin (Sn) |
端子形式: | THROUGH-HOLE | 端子位置: | SINGLE |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 晶体管应用: | POWER CONTROL |
晶体管元件材料: | SILICON | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
STGWA50H65DFB2 | STMICROELECTRONICS |
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Trench gate field-stop, 650 V, 50 A, high-speed HB2 series IGBT in a TO-247 long leads pac | |
STGWA50HP65FB2 | STMICROELECTRONICS |
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Trench gate field-stop, 650 V, 50 A, high-speed HB2 series IGBT in a TO-247 long leads pac | |
STGWA50IH65DF | STMICROELECTRONICS |
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650 V、50 A软开关沟槽栅场截止IH系列IGBT,TO-247长引线封装 | |
STGWA50M65DF2 | STMICROELECTRONICS |
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沟槽栅场截止IGBT,M系列,650 V、50 A,低损耗 | |
STGWA60H65DFB | STMICROELECTRONICS |
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650 V、60 A高速沟槽栅场截止HB系列IGBT | |
STGWA60V60DF | STMICROELECTRONICS |
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600 V、60 A超高速沟槽栅场截止IGBT | |
STGWA60V60DWFAG | STMICROELECTRONICS |
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Automotive-grade trench field-stop 600 V, 60 A very high speed V series IGBT featuring fre | |
STGWA75H65DFB2 | STMICROELECTRONICS |
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Trench gate field-stop, 650 V, 75 A, high-speed HB2 series IGBT in a TO-247 long leads pac | |
STGWA75M65DF2 | STMICROELECTRONICS |
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沟槽栅场截止IGBT,M系列,650 V、75 A,低损耗 | |
STGWA80H65DFB | STMICROELECTRONICS |
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650 V、80 A高速沟槽栅场截止HB系列IGBT |