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SSM6P54TU,LF PDF预览

SSM6P54TU,LF

更新时间: 2024-11-09 13:14:03
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
6页 179K
描述
Small Signal Field-Effect Transistor

SSM6P54TU,LF 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknownFactory Lead Time:12 weeks
风险等级:5.71Base Number Matches:1

SSM6P54TU,LF 数据手册

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SSM6P54TU  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type  
SSM6P54TU  
High-Speed Switching Applications  
Unit : mm  
Power Management Switch Applications  
2.1±0.1  
1.7±0.1  
1.5 V drive  
Suitable for high-density mounting due to compact package  
Low on-resistance : R = 228 m(max) (@ V  
= -2.5 V)  
= -1.8 V)  
= -1.5 V)  
on  
GS  
: R = 350 m(max) (@ V  
on  
GS  
1
2
6
5
: R = 555 m(max) (@ V  
on  
GS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
-20  
Unit  
V
4
3
V
DS  
Gate-Source voltage  
V
± 8  
V
GSS  
DC  
I
-1.2  
D
Drain current  
A
Pulse  
I
-2.4  
DP  
Drain power dissipation  
Channel temperature  
P (Note 1)  
500  
mW  
°C  
D
1.Sorce1  
2.Gate1  
3.Drain2  
4.Source 2  
5.Gate2  
6.Drain1  
T
ch  
150  
Storage temperature range  
T
stg  
55 ~ 150  
°C  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
UF6  
JEDEC  
JEITA  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure  
rate, etc).  
TOSHIBA  
2-2T1B  
Weight: 7.0 mg (typ.)  
Note 1: Mounted on an FR4 board.  
2
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
20  
12  
Typ.  
Max  
Unit  
V
V
V
I
I
= −1 mA, V  
= −1 mA, V  
= 0  
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-Source breakdown voltage  
= +8 V  
Drain cut-off current  
I
V
V
V
V
= 20 V, V  
= 0  
10  
± 1  
1.0  
μA  
μA  
V
DSS  
DS  
GS  
DS  
DS  
GS  
DS  
Gate leakage current  
Gate threshold voltage  
Forward transfer admittance  
I
= ± 8 V, V  
= 0  
GSS  
V
= −3 V, I = −1 mA  
0.3  
1.7  
th  
D
|Y |  
fs  
= -3 V, I = -0.6 A  
(Note 2)  
(Note 2)  
(Note 2)  
(Note 2)  
3.4  
162  
212  
249  
331  
48  
S
D
I
I
I
= -0.6 A, V  
= -0.6 A, V  
= -0.1 A, V  
= -2.5 V  
= -1.8 V  
= -1.5 V  
228  
350  
555  
D
D
D
GS  
GS  
GS  
Drain-Source on-resistance  
R
mΩ  
DS (ON)  
Input capacitance  
C
iss  
V
= −10 V, V  
= 0  
GS  
DS  
pF  
ns  
Output capacitance  
C
oss  
f = 1 MHz  
Reverse transfer capacitance  
C
39  
rss  
on  
Turn-on time  
Switching time  
t
t
19  
18  
V
V
= −10 V, I = −0.6 A  
D
DD  
GS  
= 0 ~ 2.5 V, R = 4.7 Ω  
G
Turn-off time  
off  
Total gate charge  
Q
g
7.7  
4.9  
2.8  
V
V
= −16 V, I  
= − 4 V  
= -1.2 A,  
DS  
DS  
GS  
nC  
V
Gate-Source charge  
Gate-Drain charge  
Q
Q
gs  
gd  
Drain-Source forward voltage  
V
I
= 1.2 A, V = 0  
GS  
(Note 2)  
0.8  
1.2  
DSF  
D
Note 2:  
Pulse test  
1
2007-11-01  

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