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SSM6J53FE(TE85L,F) PDF预览

SSM6J53FE(TE85L,F)

更新时间: 2024-10-02 21:22:07
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
6页 173K
描述
MOSFET P-CH 20V 1.8A ES6

SSM6J53FE(TE85L,F) 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.6
Base Number Matches:1

SSM6J53FE(TE85L,F) 数据手册

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SSM6J53FE  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type  
SSM6J53FE  
Power Management Switch Applications  
High-Speed Switching Applications  
Unit : mm  
1.6±0.05  
1.2±0.05  
1.5 V drive  
Suitable for high-density mounting due to compact package  
Low on-resistance : R = 136 m(max) (@V  
= -2.5 V)  
= -1.8 V)  
= -1.5 V)  
on  
GS  
GS  
GS  
1
2
6
5
: R = 204 m(max) (@V  
on  
: R = 364 m(max) (@V  
on  
Absolute Maximum Ratings (Ta = 25°C)  
4
3
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
V
-20  
± 8  
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
-1.8  
D
Drain current  
A
Pulse  
I
-3.6  
DP  
1,2,5,6 :Drain  
3 :Gate  
4 :Source  
Drain power dissipation  
Channel temperature  
P
(Note 1)  
500  
mW  
°C  
D
T
ch  
150  
Storage temperature range  
T
stg  
55~150  
°C  
ES6  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
TOSHIBA  
2-2N1A  
Weight: 7.0 mg (typ.)  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and  
estimated failure rate, etc).  
Note 1: Mounted on an FR4 board.  
2
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
V
I
I
= −1 mA, V  
= −1 mA, V  
= 0  
20  
12  
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-Source breakdown voltage  
= +8 V  
Drain cut-off current  
I
V
V
V
V
= 20 V, V  
= 0  
10  
±1  
μA  
μA  
V
DSS  
DS  
GS  
DS  
DS  
GS  
DS  
Gate leakage current  
Gate threshold voltage  
Forward transfer admittance  
I
= ± 8 V, V  
= 0  
GSS  
V
= −3 V, I = −1 mA  
0.3  
2.7  
1.0  
th  
D
|Y |  
fs  
= −3 V, I = −0.9 A  
(Note 2)  
= −2.5 V (Note 2)  
= −1.8 V (Note 2)  
= −1.5 V (Note 2)  
5.4  
95  
S
D
I
I
I
= −1.0 A, V  
= −1.0 A, V  
= −0.1 A, V  
136  
204  
364  
D
D
D
GS  
GS  
GS  
Drain-Source on-resistance  
R
mΩ  
122  
137  
568  
75  
DS (ON)  
Input capacitance  
C
iss  
V
= −10 V, V  
= 0  
GS  
DS  
pF  
ns  
Output capacitance  
C
oss  
f = 1 MHz  
Reverse transfer capacitance  
C
67  
rss  
on  
Turn-on time  
t
t
V
V
= −10 V, I = −0.9 A  
29  
DD  
GS  
D
Switching time  
= 0 ~ 2.5 V, R = 4.7 Ω  
G
Turn-off time  
39  
10.6  
7.4  
3.3  
0.8  
off  
Total gate charge  
Q
g
V
V
= −16 V, I  
= − 4 V  
= -1.8 A,  
DS  
DS  
GS  
nC  
V
Gate-Source charge  
Q
gs  
gd  
Gate-Drain charge  
Q
Drain-Source forward voltage  
V
I
= 1.8 A, V = 0  
GS  
(Note 2)  
1.2  
DSF  
D
Note 2: Pulse test  
1
2007-11-01  

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