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SSM6K211FE PDF预览

SSM6K211FE

更新时间: 2024-11-18 06:14:15
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
6页 198K
描述
High-Speed Switching Applications Power Management Switch Applications

SSM6K211FE 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F6针数:6
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.34配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (ID):3.2 A
最大漏源导通电阻:0.059 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F6元件数量:1
端子数量:6工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSM6K211FE 数据手册

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SSM6K211FE  
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type (U-MOS)  
SSM6K211FE  
High-Speed Switching Applications  
Power Management Switch Applications  
Unit: mm  
1.5-V drive  
Low ON-resistance:  
R
on  
R
on  
R
on  
R
on  
= 118 mΩ (max) (@V  
= 1.5 V)  
= 1.8 V)  
= 2.5 V)  
= 4.5 V)  
GS  
=
=
=
82 mΩ (max) (@V  
GS  
GS  
GS  
59 mΩ (max) (@V  
47 mΩ (max) (@V  
Absolute Maximum Ratings (Ta = 25˚C)  
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
20  
± 10  
3.2  
V
V
DSS  
Gate-source voltage  
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
6.4  
DP  
1,2, 5, 6: Drain  
Drain power dissipation  
Channel temperature  
Storage temperature  
P
(Note 1)  
500  
150  
mW  
°C  
D
3:  
4:  
Gate  
Source  
T
ch  
ES6  
T
stg  
55 to 150  
°C  
JEDEC  
JEITA  
Note:Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
TOSHIBA  
2-2N1J  
Weight: 3 mg (typ.)  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report  
and estimated failure rate, etc).  
Note 1: Mounted on an FR4 board  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)  
Marking  
Equivalent Circuit (top view)  
6
5
4
6
5
4
NQ  
1
2
3
1
2
3
1
2008-11-21  

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