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SSM6K24FE PDF预览

SSM6K24FE

更新时间: 2024-11-18 03:50:47
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
5页 159K
描述
High Speed Switching Applications

SSM6K24FE 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:2-2N1A, 6 PIN针数:6
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.46配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):0.5 A
最大漏极电流 (ID):0.5 A最大漏源导通电阻:0.145 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-F6
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.5 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

SSM6K24FE 数据手册

 浏览型号SSM6K24FE的Datasheet PDF文件第2页浏览型号SSM6K24FE的Datasheet PDF文件第3页浏览型号SSM6K24FE的Datasheet PDF文件第4页浏览型号SSM6K24FE的Datasheet PDF文件第5页 
SSM6K24FE  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (U-MOSIII)  
SSM6K24FE  
High Speed Switching Applications  
Unit: mm  
1.6±0.05  
1.2±0.05  
Optimum for high-density mounting in small packages  
Low on-resistance:  
R
on  
on  
= 145m(max) (@V  
= 180m(max) (@V  
= 4.5 V)  
= 2.5 V)  
GS  
GS  
R
1
2
6
5
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
4
3
V
30  
± 12  
0.5  
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
1.5  
DP  
P
D
Drain power dissipation  
Channel temperature  
500  
mW  
1,2,5,6 :Drain  
3 :Gate  
4 :Source  
(Note 1)  
T
ch  
150  
°C  
°C  
Storage temperature range  
T
stg  
55~150  
ES6  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
TOSHIBA  
2-2N1A  
Weight: 3.0 mg (typ.)  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and  
individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board.  
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )  
2
Marking  
Equivalent Circuit (top view)  
6
1
5
4
3
6
5
4
NF  
2
1
2
3
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is  
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects  
that come into direct contact with devices should be made of anti-static materials.  
1
2007-11-01  

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