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SIB404DK-T1-GE3 PDF预览

SIB404DK-T1-GE3

更新时间: 2024-11-15 09:25:39
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
9页 193K
描述
N-Channel 12 V (D-S) MOSFET

SIB404DK-T1-GE3 技术参数

生命周期:Obsolete零件包装代码:SC-75
包装说明:SMALL OUTLINE, S-PDSO-C3针数:6
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:7.87外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:12 V
最大漏极电流 (Abs) (ID):9 A最大漏极电流 (ID):9 A
最大漏源导通电阻:0.019 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-C3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):13 W
最大脉冲漏极电流 (IDM):35 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIB404DK-T1-GE3 数据手册

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New Product  
SiB404DK  
Vishay Siliconix  
N-Channel 12 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
ID (A)a  
VDS (V)  
RDS(on) ()  
Qg (Typ.)  
Definition  
0.019 at VGS = 4.5 V  
0.022 at VGS = 2.5 V  
0.026 at VGS = 1.8 V  
0.065 at VGS = 1.2 V  
9
9
9
3
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
SC-75 Package  
12  
9.6 nC  
- Small Footprint Area  
- Low On-Resistance  
- Thin 0.75 mm Profile  
100 % Rg Tested  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK SC-75-6L-Single  
D
APPLICATIONS  
1
D
Portable Devices  
2
D
Low Voltage Gate Drive Load Switch  
3
Marking Code  
G
G
D
6
A I X  
S
D
Part # code  
5
X X X  
1.60 mm  
S
Lot Traceability  
and Date code  
1.60 mm  
S
4
Ordering Information: SiB404DK-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
VDS  
Limit  
12  
5
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
T
C = 25 °C  
C = 70 °C  
9a  
9a  
8.9b, c  
7.1b, c  
35  
9a  
2.1b, c  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
T
C = 25 °C  
TA = 25 °C  
C = 25 °C  
TC = 70 °C  
A = 25 °C  
Continuous Source-Drain Diode Current  
T
13  
8.4  
PD  
Maximum Power Dissipation  
W
2.5b, c  
1.6b, c  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
41  
Maximum  
Unit  
t 5 s  
Steady State  
51  
°C/W  
RthJC  
7.5  
9.5  
Notes:  
a. Package limited, TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 105 °C/W.  
Document Number: 67099  
S11-0236-Rev. A, 14-Feb-11  
www.vishay.com  
1

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