Datasheet > SIB406EDK

SIB406EDK

更新时间： 2024-11-15 09:25:39

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	226K
描述
N-Channel 20-V (D-S) MOSFET

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SIB406EDK 数据手册

New Product

SiB406EDK

Vishay Siliconix

N-Channel 20-V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

V_DS(V)

R_DS(on)(Ω)

Q_g(Typ.)

_D(A)^a

TrenchFET^®Power MOSFET

0.046 at V_GS= 4.5 V

0.063 at V_GS= 2.5 V

New Thermally Enhanced PowerPAK^®

SC-75 Package

3.5 nC

- Small Footprint Area

- Low On-Resistance

•

Typical ESD Protection 560 V

APPLICATIONS

•

Load Switch for Portable Applications

High Frequency DC/DC Converter

PowerPAK SC-75-6L-Single

Marking Code

A D X

X X X

Part # code

Lot Traceability

and Date code

1.60 mm

N-Channel MOSFET

Ordering Information: SiB406EDK-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted

Parameter

Drain-Source Voltage

Gate-Source Voltage

Symbol

V_DS

V_GS

Limit

6^a

5.1^{b, c}

4.1^{b, c}

6^a

1.6^{b, c}

Unit

_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

I_DM

I_S

Pulsed Drain Current

_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

T_C= 25 °C

_C= 70 °C

6.4

P_D

Maximum Power Dissipation

1.95^{b, c}

T_A= 25 °C

T_A= 70 °C

1.25^{b, c}

- 55 to 150

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

°C

260

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

R_thJC

Typical

Maximum

Unit

t ≤ 5 s

Steady State

°C/W

12.5

Notes:

a. Package limited

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 100 °C/W.

Document Number: 69088

S-83095-Rev. A, 29-Dec-08

www.vishay.com

12 3 4 5 6 7...9

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