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SIB412DK-T1-E3 PDF预览

SIB412DK-T1-E3

更新时间: 2024-11-23 22:57:43
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 135K
描述
MOSFET N-CH 20V 9A SC75-6

SIB412DK-T1-E3 数据手册

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New Product  
SiB412DK  
Vishay Siliconix  
N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
TrenchFET® Power MOSFET  
9a  
9a  
9a  
0.034 at VGS = 4.5 V  
0.040 at VGS = 2.5 V  
0.054 at VGS = 1.8 V  
New Thermally Enhanced PowerPAK®  
SC-75 Package  
RoHS  
20  
6.14 nC  
COMPLIANT  
- Small Footprint Area  
- Low On-Resistance  
APPLICATIONS  
Load Switch, PA Switch and Battery Switch for Portable  
Devices  
PowerPAK SC-75-6L-Single  
D
DC/DC Converter  
1
D
2
Marking Code  
D
3
A A X  
X X X  
G
G
Part # code  
D
6
Lot Traceability  
and Date code  
S
D
5
1.60 mm  
S
1.60 mm  
S
4
N-Channel MOSFET  
Ordering Information: SiB412DK-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
20  
Unit  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
V
8
9a  
T
C = 25 °C  
C = 70 °C  
9a  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
6.6b, c  
5.29b, c  
20  
9a  
2b, c  
13  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
8.4  
PD  
Maximum Power Dissipation  
W
2.4b, c  
1.6b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
41  
Maximum  
Unit  
t 5 s  
Steady State  
51  
°C/W  
RthJC  
7.5  
9.5  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 Board.  
c. t = 5 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 105 °C/W.  
Document Number: 70439  
S-80515-Rev. C, 10-Mar-08  
www.vishay.com  
1

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