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SIB422EDK

更新时间: 2024-09-28 09:25:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 229K
描述
N-Channel 20-V (D-S) MOSFET

SIB422EDK 数据手册

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New Product  
SiB422EDK  
Vishay Siliconix  
N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
ID (A)a  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
Definition  
0.030 at VGS = 4.5 V  
0.041 at VGS = 2.5 V  
0.057 at VGS = 1.8 V  
0.082 at VGS = 1.5 V  
9
9
9
5
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
SC-75 Package  
20  
6 nC  
- Small Footprint Area  
- Low On-Resistance  
- Thin 0.75 mm Profile  
Typical ESD Protection 4000 V  
100 % Rg Tested  
PowerPAK SC-75-6L-Single  
D
Compliant to RoHS Directive 2002/95/EC  
1
D
APPLICATIONS  
2
R
D
Portable Devices  
- Load Switch  
- Battery Switch  
G
3
Marking Code  
G
D
6
A F X  
X X X  
S
D
Part # code  
5
Lot Traceability  
and Date code  
1.60 mm  
S
1.60 mm  
4
Ordering Information: SiB422EDK-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
VDS  
Limit  
20  
8
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
T
C = 25 °C  
C = 70 °C  
9a  
9a  
7.1b, c  
5.7b, c  
25  
9a  
2.1b, c  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
TC = 25 °C  
13  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
8.4  
PD  
Maximum Power Dissipation  
W
2.5b, c  
1.6b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
41  
Maximum  
Unit  
t 5 s  
Steady State  
51  
°C/W  
RthJC  
7.5  
9.5  
Notes:  
a. Package limited, TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 105 °C/W.  
Document Number: 65297  
S09-1919-Rev. A, 28-Sep-09  
www.vishay.com  
1

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