Datasheet > SIB488DK

SIB488DK

更新时间： 2024-09-28 09:25:39

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	231K
描述
N-Channel 12 V (D-S) MOSFET

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SIB488DK 数据手册

New Product

SiB488DK

Vishay Siliconix

N-Channel 12 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

V_DS(V)

R_DS(on)(Ω)

I_D(A)^a

Q_g(Typ.)

Definition

•

TrenchFET^®Power MOSFET

0.020 at V_GS= 4.5 V

0.024 at V_GS= 2.5 V

0.029 at V_GS= 1.8 V

New Thermally Enhanced PowerPAK^®

SC-75 Package

7.5 nC

- Small Footprint Area

- Low On-Resistance

•

100 % R Tested

Compliant to RoHS Directive 2002/95/EC

PowerPAK SC-75-6L-Single

APPLICATIONS

•

Load Switch, PA Switch and Battery Switch for Portable

Devices

•

High Frequency dc-to-dc Converters

Marking Code

A G X

Part # code

X X X

1.60 mm

Lot Traceability

and Date code

Ordering Information: SiB488DK-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted

Parameter

Symbol

Limit

Unit

V_DS

V_GS

Drain-Source Voltage

Gate-Source Voltage

9^a

_C= 25 °C

_C= 70 °C

9^a

Continuous Drain Current (T_J= 150 °C)

I_D

9^{b, c}

7.2^{b, c}

9^a

2^{b, c}

T_A= 25 °C

T_A= 70 °C

I_DM

I_S

Pulsed Drain Current

T_C= 25 °C

T_A= 25 °C

Continuous Source-Drain Diode Current

_C= 25 °C

T_C= 70 °C

_A= 25 °C

8.4

P_D

Maximum Power Dissipation

2.4^{b, c}

1.6^{b, c}

T_A= 70 °C

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

Typical

Maximum

Unit

t ≤ 5 s

Steady State

°C/W

R_thJC

7.5

9.5

Notes:

a. T_C= 25 °C, package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 105 °C/W.

Document Number: 65668

S10-1052-Rev. B, 03-May-10

www.vishay.com

12 3 4 5 6 7...9

中文翻译

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