Datasheet > SIB456DK

SIB456DK

更新时间： 2024-09-28 12:22:35

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	224K
描述
N-Channel 100 V (D-S) MOSFET

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SIB456DK 数据手册

New Product

SiB456DK

Vishay Siliconix

www.vishay.com

N-Channel 100 V (D-S) MOSFET

FEATRUES

PRODUCT SUMMARY

• TrenchFET^®Power MOSFET

V_DS(V)

R_DS(on)() MAX.

0.185 at V_GS= 10 V

0.310 at V_GS= 4.5 V

I_D(A)^a

6.3

Q_g(Typ.)

• New Thermally Enhanced PowerPAK^®SC-75

Package

100

1.8 nC

4.9

- Small Footprint Area

- Low On-Resistance

• 100 % R_gand UIS Tested

PowerPAK SC-75-6L-Single

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• DC/DC Converters

• Full-Bridge Converters

• For Power Bricks and POL Power

Marking Code

1.60 mm

A J X

Part # code

X X X

Lot Traceability

and Date code

Ordering Information:

SiB456DK-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

100

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

6.3

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

2.7^{b, c}

2.2^{b, c}

Pulsed Drain Current (t = 300 μs)

I_DM

I_S

T_C= 25 °C

6.3

2^{b, c}

Continuous Source-Drain Diode Current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

I_AS

2.4

E_AS

0.29

_C= 70 °C

8.4

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

2.4^{b, c}

1.6^{b, c}

- 55 to 150

260

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Symbol

R_thJA

Typical

Maximum

Unit

t  5 s

°C/W

Maximum Junction-to-Case (Drain)

Steady State

R_thJC

7.5

9.5

Notes

a. T_C= 25 °C.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 105 °C/W.

S12-1133-Rev. A, 21-May-12

Document Number: 62715

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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