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SIB408DK

更新时间: 2024-11-15 09:25:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 228K
描述
N-Channel 30-V (D-S) MOSFET

SIB408DK 数据手册

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New Product  
SiB408DK  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
Definition  
7a  
7a  
0.040 at VGS = 10 V  
0.050 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
SC-75 Package  
30  
2.9 nC  
- Small Footprint Area  
- Low On-Resistance  
100 % Rg Tested  
PowerPAK SC-75-6L-Single  
100 % UIS Tested  
Compliant to RoHS Directive 2002/95/EC  
D
1
APPLICATIONS  
D
2
Notebook  
D
Marking Code  
3
- Load Switch  
G
G
D
A E X  
6
Part # code  
S
D
X X X  
5
Lot Traceability  
and Date code  
1.60 mm  
S
1.60 mm  
S
4
Ordering Information: SiB408DK-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
VGS  
Limit  
30  
Unit  
V
20  
7a  
7a  
T
C = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
6b, c  
TA = 25 °C  
TA = 70 °C  
4.8b, c  
20  
7a  
2b, c  
10  
A
Pulsed Drain Current  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
Avalanche Current Pulse  
Avalanche Energy  
IAS  
EAS  
L = 0.1 mH  
5
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
13  
8.4  
PD  
Maximum Power Dissipation  
2.4b, c  
1.6b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
RthJC  
Typical  
41  
Maximum  
Unit  
t 5 s  
51  
°C/W  
Steady State  
7.5  
9.5  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 105 °C/W.  
Document Number: 64828  
S09-0859-Rev. A, 18-May-09  
www.vishay.com  
1

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