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SI7386DP PDF预览

SI7386DP

更新时间: 2024-11-03 01:16:11
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
12页 297K
描述
N-Channel Reduced Qg, Fast Switching MOSFET

SI7386DP 数据手册

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Si7386DP  
Vishay Siliconix  
N-Channel Reduced Q , Fast Switching MOSFET  
g
FEATURES  
PRODUCT SUMMARY  
Halogen-free available  
TrenchFET® Gen II Power MOSFET  
PWM Optimized for High Efficiency  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
19  
Qg (Typ.)  
RoHS  
COMPLIANT  
0.007 at VGS = 10 V  
0.0095 at VGS = 4.5 V  
30  
11.5  
17  
100 % Rg Tested  
PowerPAK SO-8  
APPLICATIONS  
DC/DC Conversion for PC  
S
6.15 mm  
5.15 mm  
1
S
D
2
S
3
G
4
D
8
D
7
D
G
6
D
5
Bottom View  
Ordering Information: Si7386DP-T1-E3 (Lead (Pb)-free)  
S
N-Channel MOSFET  
Si7386DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
30  
20  
V
VGS  
TA = 25 °C  
TA = 70 °C  
19  
16  
12  
9
Continuous Drain Current (TJ = 150 °C)a  
ID  
IDM  
IS  
Pulsed Drain Current  
50  
A
Continuous Source Current (Diode Conduction)a  
Avalanche Current  
4.1  
1.5  
IAS  
EAS  
25  
32  
L = 0.1 mH  
Single Pulse Avalanche Energy  
mJ  
W
TA = 25 °C  
TA = 70 °C  
5
1.8  
1.1  
Maximum Power Dissipationa  
PD  
3.2  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
21  
Maximum  
Unit  
t 10 s  
25  
70  
Maximum Junction-to-Ambient (MOSFET)a  
Maximum Junction-to-Case (Drain)  
RthJA  
Steady State  
Steady State  
56  
°C/W  
RthJC  
2.4  
3.0  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73108  
S-80439-Rev. C, 03-Mar-08  
www.vishay.com  
1

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