Si7403BDN
Vishay Siliconix
New Product
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
D TrenchFETr Power MOSFET: 2.5-V Rated
VDS (V)
rDS(on) (W)
ID (A)
Qg (Typ)
D RoHS Compliant
c
Product Is
Completely
Pb-free
0.074 @ V = −4.5 V
−8
GS
D New PowerPAKr Package
− Low Thermal Resistance
− Low 1.07-mm Profile
−20
5.6 nC
0.110 @ V = −2.5 V
−7.4
GS
APPLICATIONS
D Load Switching
D PA Switching
PowerPAK 1212-8
S
S
3.30 mm
3.30 mm
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
5
D
P-Channel MOSFET
Bottom View
Ordering Information: Si7403BDN-T1—E3
ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)
A
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V
DS
V
GS
−20
"8
V
c
T
T
= 25_C
= 70_C
= 25_C
= 70_C
−8
C
−7.2
a, b,
C
a, b
Continuous Drain Current (T = 150__C)
I
J
D
T
A
−5.1
a, b
T
A
−4.1
A
Pulsed Drain Current
I
−20
−8
DM
T
C
= 25_C
= 25_C
= 25_C
= 70_C
= 25_C
= 70_C
a, b
Continuous Source-Drain Diode Current
I
S
a, b
T
A
−2.6
T
C
T
C
9.6
6.1
a, b
3.1
a, b
Maximum Power Dissipation
P
W
D
T
A
a, b
T
A
2
Operating Junction and Storage Temperature Range
T , T
−55 to 150
J
stg
_C
c, d
Soldering Recommendations (Peak Temperature)
260
Notes:
a. Surface Mounted on 1” x 1” FR4 Board.
b. t = 5 sec
c. Package limited.
d. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73333
S-50519—Rev. A, 21-Mar-05
www.vishay.com
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