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SI5902BDC-T1-GE3 PDF预览

SI5902BDC-T1-GE3

更新时间: 2024-10-30 09:25:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 117K
描述
Dual N-Channel 30 V (D-S) MOSFET

SI5902BDC-T1-GE3 数据手册

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Si5902BDC  
Vishay Siliconix  
Dual N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
Definition  
4a  
4a  
0.065 at VGS = 10 V  
0.100 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
Compliant to RoHS Directive 2002/95/EC  
30  
2 nC  
APPLICATIONS  
Load Switch for Portable Applications  
DC/DC Converter  
1206-8 ChipFET® (Dual)  
1
D
1
D
2
S
1
D
G
1
1
D
S
1
2
Marking Code  
D
G
2
2
G
1
G
2
CE XXX  
D
Lot Traceability  
and Date Code  
2
Part #  
Code  
S
1
S
2
Bottom View  
N-Channel MOSFET  
N-Channel MOSFET  
Ordering Information: Si5902BDC-T1-E3 (Lead (Pb)-free)  
Si5902BDC-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
20  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
4a  
T
T
C = 25 °C  
C = 85 °C  
3.8a  
Continuous Drain Current (TJ = 150 °C)  
ID  
3.7b, c  
2.6b, c  
10  
TA = 25 °C  
TA = 85 °C  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
2.6  
1.3b, c  
3.12  
Continuous Source-Drain Diode Current  
T
A = 25 °C  
C = 25 °C  
T
TC = 85 °C  
TA = 25 °C  
TA = 85 °C  
2.0  
PD  
Maximum Power Dissipation  
W
1.5b, c  
0.8b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Symbol  
RthJA  
Typical  
70  
Maximum  
Unit  
t 5 s  
Steady State  
85  
40  
°C/W  
Maximum Junction-to-Foot (Drain)  
RthJF  
33  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The 1206-8 ChipFET is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 120 °C/W.  
Document Number: 70415  
S10-0548-Rev. B, 08-Mar-10  
www.vishay.com  
1

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