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NVMFD6H846NL PDF预览

NVMFD6H846NL

更新时间: 2024-11-17 02:52:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 210K
描述
MOSFET - Power, Dual N-Channel

NVMFD6H846NL 数据手册

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MOSFET - Power, Dual  
N-Channel  
80 V, 15 mW, 31 A  
NVMFD6H846NL  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
NVMFD6H846NLWF Wettable Flank Option for Enhanced  
Optical Inspection  
15 mW @ 10 V  
19 mW @ 4.5 V  
80 V  
31 A  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
Dual NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D1  
D2  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
31  
A
G1  
G2  
C
D
q
JC  
T
C
22  
(Notes 1, 2, 3)  
Steady  
State  
S1  
S2  
Power Dissipation  
T
C
P
34  
W
A
D
R
(Notes 1, 2)  
q
JC  
T
C
= 100°C  
17  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
9.4  
6.7  
3.2  
1.6  
114  
MARKING  
DIAGRAM  
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
Steady  
State  
D1 D1  
Power Dissipation  
T = 25°C  
A
P
W
D
S1  
G1  
S2  
G2  
D1  
1
R
(Notes 1, 2)  
q
JA  
D1  
D2  
D2  
XXXXXX  
AYWZZ  
T = 100°C  
A
DFN8 5x6  
(SO8FL)  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
CASE 506BT  
D2 D2  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
A
Y
= Assembly Location  
= Year  
Source Current (Body Diode)  
I
28  
A
S
W
ZZ  
= Work Week  
= Lot Traceability  
Single Pulse DraintoSource Avalanche  
E
AS  
201  
mJ  
Energy (T = 25°C, I  
= 1.1 A)  
J
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
4.4  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
47  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
March, 2020 Rev. 0  
NVMFD6H846NL/D  
 

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