MOSFET - Power, Dual
N-Channel
80 V, 15 mW, 31 A
NVMFD6H846NL
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• NVMFD6H846NLWF − Wettable Flank Option for Enhanced
Optical Inspection
15 mW @ 10 V
19 mW @ 4.5 V
80 V
31 A
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Dual N−Channel
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D1
D2
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
31
A
G1
G2
C
D
q
JC
T
C
22
(Notes 1, 2, 3)
Steady
State
S1
S2
Power Dissipation
T
C
P
34
W
A
D
R
(Notes 1, 2)
q
JC
T
C
= 100°C
17
Continuous Drain
Current R
T = 25°C
A
I
D
9.4
6.7
3.2
1.6
114
MARKING
DIAGRAM
q
JA
T = 100°C
A
(Notes 1, 2, 3)
Steady
State
D1 D1
Power Dissipation
T = 25°C
A
P
W
D
S1
G1
S2
G2
D1
1
R
(Notes 1, 2)
q
JA
D1
D2
D2
XXXXXX
AYWZZ
T = 100°C
A
DFN8 5x6
(SO8FL)
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
CASE 506BT
D2 D2
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
A
Y
= Assembly Location
= Year
Source Current (Body Diode)
I
28
A
S
W
ZZ
= Work Week
= Lot Traceability
Single Pulse Drain−to−Source Avalanche
E
AS
201
mJ
Energy (T = 25°C, I
= 1.1 A)
J
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
4.4
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
47
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
March, 2020 − Rev. 0
NVMFD6H846NL/D