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NVMFS4C

更新时间: 2024-11-17 01:01:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 85K
描述
Power MOSFET

NVMFS4C 数据手册

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NVMFS4C03N  
Power MOSFET  
30 V, 1.7 mW, 159 A, Single N−Channel  
Logic Level, SO−8FL  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
1.7 mW @ 10 V  
2.4 mW @ 4.5 V  
30 V  
NVMFS4C03NWF − Wettable Flanks Option for Enhanced Optical  
Inspection  
159 A  
AEC−Q101 Qualified and PPAP Capable  
D (5,6)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
G (4)  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
S (1,2,3)  
N−CHANNEL MOSFET  
Gate−to−Source Voltage  
Continuous Drain Cur-  
V
"20  
159  
V
GS  
T
T
= 25°C  
= 25°C  
I
A
C
D
rent R  
3)  
(Notes 1, 2,  
q
JC  
Steady  
State  
MARKING  
DIAGRAM  
Power Dissipation  
(Notes 1, 2)  
P
77  
W
A
C
D
R
D
q
JC  
S
S
S
G
D
D
Continuous Drain Cur-  
T = 25°C  
A
I
34.9  
D
1
4C03xx  
AYWZZ  
rent R  
3)  
(Notes 1, 2,  
q
JA  
Steady  
State  
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 1  
Power Dissipation  
(Notes 1, 2)  
T = 25°C  
A
P
3.71  
900  
W
D
D
R
q
JA  
4C03N = Specific Device Code for  
NVMFS4C03N  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
4C03WF= Specific Device Code of  
NVMFS4C03NWF  
J
stg  
A
Y
= Assembly Location  
= Year  
Source Current (Body Diode)  
I
S
64  
A
Single Pulse Drain−to−Source Avalanche  
E
AS  
549  
mJ  
W
ZZ  
= Work Week  
= Lot Traceabililty  
Energy (I  
= 11 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
NVMFS4C03NT1G  
SO−8 FL  
1500 /  
(Pb−Free) Tape & Reel  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
Unit  
NVMFS4C03NT3G  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
SO−8 FL 1500 /  
(Pb−Free) Tape & Reel  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
Junction−to−Case − Steady State (Note 2)  
Junction−to−Ambient − Steady State (Note 2)  
R
1.95  
40  
°C/W  
q
q
JC  
NVMFS4C03NWFT1G  
R
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
NVMFS4C03NWFT3G  
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
April, 2016 − Rev. 2  
NVMFS4C03N/D  
 

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