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NVMFS4C05N PDF预览

NVMFS4C05N

更新时间: 2024-09-30 01:05:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 76K
描述
Single N−Channel Power MOSFET

NVMFS4C05N 数据手册

 浏览型号NVMFS4C05N的Datasheet PDF文件第2页浏览型号NVMFS4C05N的Datasheet PDF文件第3页浏览型号NVMFS4C05N的Datasheet PDF文件第4页浏览型号NVMFS4C05N的Datasheet PDF文件第5页浏览型号NVMFS4C05N的Datasheet PDF文件第6页 
NVMFS4C05N  
Power MOSFET  
30 V, 116 A, Single N−Channel, SO−8 FL  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
NVMFS4C05NWF − Wettable Flanks Option for Enhanced Optical  
Inspection  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
AEC−Q101 Qualified and PPAP Capable  
3.4 mW @ 10 V  
5.0 mW @ 4.5 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
30 V  
116 A  
Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
D (5−8)  
Parameter  
Drain−to−Source Voltage  
Gate−to−Source Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
V
GS  
20  
V
G (4)  
Continuous Drain  
Current R  
T = 25°C  
24.7  
19.6  
3.61  
A
A
I
D
q
JA  
T = 80°C  
A
(Notes 1, 2 and 4)  
S (1,2,3)  
N−CHANNEL MOSFET  
Power Dissipation  
T = 25°C  
A
W
R
(Notes 1, 2  
P
D
q
JA  
and 4)  
MARKING  
DIAGRAM  
Continuous Drain  
Current R  
(Notes 1, 2, 3  
and 4)  
T
= 25°C  
= 80°C  
116  
92  
C
C
q
JC  
Steady  
State  
D
S
S
S
G
D
D
1
I
A
D
4C05xx  
AYWZZ  
Continuous Drain  
Current R  
(Notes 1, 2, 3  
and 4)  
T
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 1  
q
JC  
D
4C05N = Specific Device Code for  
NVMFS4C05N  
Power Dissipation  
T
C
= 25°C  
P
79  
W
D
R
(Notes 1, 2, 3  
q
JC  
4C05WF= Specific Device Code of  
NVMFS4C05NWF  
and 4)  
Pulsed Drain  
Current  
T = 25°C, t = 10 ms  
I
DM  
174  
A
A
p
A
Y
= Assembly Location  
= Year  
W
ZZ  
= Work Week  
= Lot Traceabililty  
Operating Junction and Storage  
Temperature  
T ,  
−55 to  
+175  
°C  
J
T
STG  
Source Current (Body Diode)  
I
72  
42  
A
S
ORDERING INFORMATION  
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Energy (T = 25°C, I = 29 A , L = 0.1 mH)  
Device  
Package  
Shipping  
J
L
pk  
NVMFS4C05NT1G  
SO−8 FL  
(Pb−Free) Tape & Reel  
1500 /  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
NVMFS4C05NT3G  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
SO−8 FL 1500 /  
(Pb−Free) Tape & Reel  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
NVMFS4C05NWFT1G  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surface−mounted on FR4 board using 650 mm , 2 oz Cu pad.  
NVMFS4C05NWFT3G  
3. Assumes heat−sink sufficiently large to maintain constant case temperature  
independent of device power.  
4. Continuous DC current rating. Maximum current for pulses as long as one  
second is higher but dependent on pulse duration and duty cycle.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 − Rev. 1  
NVMFS4C05N/D  
 

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