NVMFS4C05N
Power MOSFET
30 V, 116 A, Single N−Channel, SO−8 FL
Features
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• NVMFS4C05NWF − Wettable Flanks Option for Enhanced Optical
Inspection
http://onsemi.com
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• AEC−Q101 Qualified and PPAP Capable
3.4 mW @ 10 V
5.0 mW @ 4.5 V
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
30 V
116 A
Compliant
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
D (5−8)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
30
Unit
V
V
DSS
V
GS
20
V
G (4)
Continuous Drain
Current R
T = 25°C
24.7
19.6
3.61
A
A
I
D
q
JA
T = 80°C
A
(Notes 1, 2 and 4)
S (1,2,3)
N−CHANNEL MOSFET
Power Dissipation
T = 25°C
A
W
R
(Notes 1, 2
P
D
q
JA
and 4)
MARKING
DIAGRAM
Continuous Drain
Current R
(Notes 1, 2, 3
and 4)
T
= 25°C
= 80°C
116
92
C
C
q
JC
Steady
State
D
S
S
S
G
D
D
1
I
A
D
4C05xx
AYWZZ
Continuous Drain
Current R
(Notes 1, 2, 3
and 4)
T
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
q
JC
D
4C05N = Specific Device Code for
NVMFS4C05N
Power Dissipation
T
C
= 25°C
P
79
W
D
R
(Notes 1, 2, 3
q
JC
4C05WF= Specific Device Code of
NVMFS4C05NWF
and 4)
Pulsed Drain
Current
T = 25°C, t = 10 ms
I
DM
174
A
A
p
A
Y
= Assembly Location
= Year
W
ZZ
= Work Week
= Lot Traceabililty
Operating Junction and Storage
Temperature
T ,
−55 to
+175
°C
J
T
STG
Source Current (Body Diode)
I
72
42
A
S
ORDERING INFORMATION
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
†
Energy (T = 25°C, I = 29 A , L = 0.1 mH)
Device
Package
Shipping
J
L
pk
NVMFS4C05NT1G
SO−8 FL
(Pb−Free) Tape & Reel
1500 /
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
NVMFS4C05NT3G
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
SO−8 FL 1500 /
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
NVMFS4C05NWFT1G
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using 650 mm , 2 oz Cu pad.
NVMFS4C05NWFT3G
3. Assumes heat−sink sufficiently large to maintain constant case temperature
independent of device power.
4. Continuous DC current rating. Maximum current for pulses as long as one
second is higher but dependent on pulse duration and duty cycle.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2014 − Rev. 1
NVMFS4C05N/D