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NVMFS4C03NT1G PDF预览

NVMFS4C03NT1G

更新时间: 2024-09-30 01:01:51
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲光电二极管晶体管
页数 文件大小 规格书
6页 85K
描述
Power MOSFET

NVMFS4C03NT1G 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SOP-8
Reach Compliance Code:not_compliantFactory Lead Time:7 weeks
风险等级:1.66雪崩能效等级(Eas):549 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):143 A
最大漏源导通电阻:0.0024 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):77 W最大脉冲漏极电流 (IDM):900 A
参考标准:AEC-Q101子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
晶体管元件材料:SILICONBase Number Matches:1

NVMFS4C03NT1G 数据手册

 浏览型号NVMFS4C03NT1G的Datasheet PDF文件第2页浏览型号NVMFS4C03NT1G的Datasheet PDF文件第3页浏览型号NVMFS4C03NT1G的Datasheet PDF文件第4页浏览型号NVMFS4C03NT1G的Datasheet PDF文件第5页浏览型号NVMFS4C03NT1G的Datasheet PDF文件第6页 
NVMFS4C03N  
Power MOSFET  
30 V, 1.7 mW, 159 A, Single N−Channel  
Logic Level, SO−8FL  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
1.7 mW @ 10 V  
2.4 mW @ 4.5 V  
30 V  
NVMFS4C03NWF − Wettable Flanks Option for Enhanced Optical  
Inspection  
159 A  
AEC−Q101 Qualified and PPAP Capable  
D (5,6)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
G (4)  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
S (1,2,3)  
N−CHANNEL MOSFET  
Gate−to−Source Voltage  
Continuous Drain Cur-  
V
"20  
159  
V
GS  
T
T
= 25°C  
= 25°C  
I
A
C
D
rent R  
3)  
(Notes 1, 2,  
q
JC  
Steady  
State  
MARKING  
DIAGRAM  
Power Dissipation  
(Notes 1, 2)  
P
77  
W
A
C
D
R
D
q
JC  
S
S
S
G
D
D
Continuous Drain Cur-  
T = 25°C  
A
I
34.9  
D
1
4C03xx  
AYWZZ  
rent R  
3)  
(Notes 1, 2,  
q
JA  
Steady  
State  
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 1  
Power Dissipation  
(Notes 1, 2)  
T = 25°C  
A
P
3.71  
900  
W
D
D
R
q
JA  
4C03N = Specific Device Code for  
NVMFS4C03N  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
4C03WF= Specific Device Code of  
NVMFS4C03NWF  
J
stg  
A
Y
= Assembly Location  
= Year  
Source Current (Body Diode)  
I
S
64  
A
Single Pulse Drain−to−Source Avalanche  
E
AS  
549  
mJ  
W
ZZ  
= Work Week  
= Lot Traceabililty  
Energy (I  
= 11 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
NVMFS4C03NT1G  
SO−8 FL  
1500 /  
(Pb−Free) Tape & Reel  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
Unit  
NVMFS4C03NT3G  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
SO−8 FL 1500 /  
(Pb−Free) Tape & Reel  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
Junction−to−Case − Steady State (Note 2)  
Junction−to−Ambient − Steady State (Note 2)  
R
1.95  
40  
°C/W  
q
q
JC  
NVMFS4C03NWFT1G  
R
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
NVMFS4C03NWFT3G  
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
April, 2016 − Rev. 2  
NVMFS4C03N/D  
 

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