NVMFS4C03N
Power MOSFET
30 V, 2.1 mW, 143 A, Single N−Channel
Logic Level, SO−8FL
Features
http://onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
2.1 mW @ 10 V
2.8 mW @ 4.5 V
30 V
• NVMFS4C03NWF − Wettable Flanks Option for Enhanced Optical
Inspection
143 A
• AEC−Q101 Qualified and PPAP Capable
D (5,6)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
G (4)
Parameter
Drain−to−Source Voltage
Symbol
Value
30
Unit
V
V
DSS
S (1,2,3)
N−CHANNEL MOSFET
Gate−to−Source Voltage
Continuous Drain Cur-
V
"20
143
V
GS
T
T
= 25°C
= 25°C
I
A
C
D
rent R
3)
(Notes 1, 2,
q
JC
Steady
State
MARKING
DIAGRAM
Power Dissipation
(Notes 1, 2)
P
77
W
A
C
D
R
D
q
JC
S
S
S
G
D
D
Continuous Drain Cur-
T = 25°C
A
I
31.4
D
1
4C03xx
AYWZZ
rent R
3)
(Notes 1, 2,
q
JA
Steady
State
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
Power Dissipation
(Notes 1, 2)
T = 25°C
A
P
3.71
900
W
D
D
R
q
JA
4C03N = Specific Device Code for
NVMFS4C03N
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
T , T
−55 to
175
°C
4C03WF= Specific Device Code of
NVMFS4C03NWF
J
stg
A
Y
= Assembly Location
= Year
Source Current (Body Diode)
I
S
64
A
Single Pulse Drain−to−Source Avalanche
E
AS
549
mJ
W
ZZ
= Work Week
= Lot Traceabililty
Energy (I
= 11 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
†
Device
Package
Shipping
NVMFS4C03NT1G
SO−8 FL
1500 /
(Pb−Free) Tape & Reel
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
Unit
NVMFS4C03NT3G
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
SO−8 FL 1500 /
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
Junction−to−Case − Steady State (Note 2)
Junction−to−Ambient − Steady State (Note 2)
R
1.95
40
°C/W
q
q
JC
NVMFS4C03NWFT1G
R
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
NVMFS4C03NWFT3G
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2014 − Rev. 1
NVMFS4C03N/D