DATA SHEET
www.onsemi.com
MOSFET – Power, Single
N-Channel
100 V, 14 mW, 46 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
14 mW @ 10 V
20 mW @ 4.5 V
100 V
46 A
NVMFS016N10MCL
D (5,6)
Features
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G
G (4)
• AEC−Q101 Qualified and PPAP Capable
• NVMFWS016N10MCL − Wettable Flank Products
• These Devices are Pb−Free, Halogen Free/BFR Free, Beryllium Free
and are RoHS Compliant
S (1,2,3)
N−CHANNEL MOSFET
MARKING
DIAGRAM
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
100
20
Unit
V
D
V
DSS
S
S
S
G
D
D
1
Gate−to−Source Voltage
V
GS
V
XXXXXX
AYWZZ
DFN5
CASE 488AA
STYLE 1
Continuous Drain
T
= 25°C
= 100°C
= 25°C
I
46
A
C
D
Current R
(Note 1)
q
JC
T
C
32
D
D
Steady
State
Power Dissipation
(Note 1)
T
C
P
64
W
A
D
R
q
JC
S
S
S
G
D
D
T
C
= 100°C
32
XXXXXX
AYWZZ
Continuous Drain
Current R
T = 25°C
I
10.9
7.7
3.6
1.8
243
A
D
DFNW5
(for WF Version)
CASE 507BA
q
JA
T = 100°C
A
(Notes 1, 2)
Steady
State
D
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1, 2)
XXXXXX = Specific Device Code
q
JA
T = 100°C
A
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Source Current (Body Diode)
I
S
49
A
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
Single Pulse Drain−to−Source Avalanche
E
AS
358
mJ
Energy (I
= 2.2 A)
L(pk)
Lead Temperature Soldering Reflow for Solder-
ing Purposes (1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Value
2.35
41
Unit
Junction−to−Case − Steady State (Note 1)
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using 1 in pad size, 1 oz. Cu pad.
© Semiconductor Components Industries, LLC, 2021
1
Publication Order Number:
September, 2021 − Rev. 1
NVMFS016N10MCL/D