NTMD4N03, NVMD4N03
Power MOSFET
4 A, 30 V, N−Channel SO−8 Dual
Features
• Designed for use in low voltage, high speed switching applications
• Ultra Low On−Resistance Provides
http://onsemi.com
Higher Efficiency and Extends Battery Life
− R
− R
= 0.048 W, V = 10 V (Typ)
DS(on)
DS(on)
GS
= 0.065 W, V = 4.5 V (Typ)
GS
V
R
Typ
I Max
D
DSS
DS(ON)
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode is Characterized for Use in Bridge Circuits
• Diode Exhibits High Speed, with Soft Recovery
30 V
48 mW @ V = 10 V
4.0 A
GS
• NVMD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
N−Channel
D
D
• These Devices are Pb−Free and are RoHS Compliant
Applications
G
8
G
• DC−DC Converters
• Computers
• Printers
• Cellular and Cordless Phones
• Disk Drives and Tape Drives
S
S
MARKING DIAGRAM*
AND PIN ASSIGNMENT
D1 D1 D2 D2
8
1
SOIC−8
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
SUFFIX NB
CASE 751
STYLE 11
E4N03
AYWW G
G
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
V
DSS
30
V
V
V
GS
"20
1
S1 G1 S2 G2
− Continuous @ T = 25°C
− Single Pulse (tp ≤ 10 ms)
I
4.0
12
Adc
Apk
A
D
I
DM
E4N03 = Specific Device Code
Total Power Dissipation
P
D
2.0
W
°C
mJ
A
Y
WW
G
= Assembly Location
= Year
= Work Week
@ T = 25°C (Note 1)
A
Operating and Storage
Temperature Range
T , T
−55 to
+150
J
stg
= Pb−Free Package
(Note: Microdot may be in either location)
Single Pulse Drain−to−Source
E
AS
80
*For additional marking information, refer to
Application Note AND8002/D.
Avalanche Energy − Starting T = 25°C
J
(V = 25 Vdc, V = 5.0 Vdc,
DD
GS
Peak I = 4.45 Apk, L = 8 mH,
L
R
G
= 25 W)
ORDERING INFORMATION
Thermal Resistance
R
q
JA
62.5
260
°C/W
°C
− Junction−to−Ambient (Note 1)
†
Device
Package
SOIC−8
(Pb−Free)
Shipping
2500 / Tape &
Reel
NTMD4N03R2G
Maximum Lead Temperature for
T
L
Soldering Purposes for 10 seconds
NVMD4N03R2G*
SOIC−8
(Pb−Free)
2500 / Tape &
Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
1. When surface mounted to an FR4 board using 1″ pad size, t ≤ 10 s
©
Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
August, 2013 − Rev. 4
NTMD4N03R2/D