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NVMD4N03 PDF预览

NVMD4N03

更新时间: 2024-11-23 12:04:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 126K
描述
Power MOSFET 4 A, 30 V, N−Channel SO−8 Dual

NVMD4N03 数据手册

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NTMD4N03, NVMD4N03  
Power MOSFET  
4 A, 30 V, NChannel SO8 Dual  
Features  
Designed for use in low voltage, high speed switching applications  
Ultra Low OnResistance Provides  
http://onsemi.com  
Higher Efficiency and Extends Battery Life  
R  
R  
= 0.048 W, V = 10 V (Typ)  
DS(on)  
DS(on)  
GS  
= 0.065 W, V = 4.5 V (Typ)  
GS  
V
R
Typ  
I Max  
D
DSS  
DS(ON)  
Miniature SO8 Surface Mount Package Saves Board Space  
Diode is Characterized for Use in Bridge Circuits  
Diode Exhibits High Speed, with Soft Recovery  
30 V  
48 mW @ V = 10 V  
4.0 A  
GS  
NVMD Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable*  
NChannel  
D
D
These Devices are PbFree and are RoHS Compliant  
Applications  
G
8
G
DCDC Converters  
Computers  
Printers  
Cellular and Cordless Phones  
Disk Drives and Tape Drives  
S
S
MARKING DIAGRAM*  
AND PIN ASSIGNMENT  
D1 D1 D2 D2  
8
1
SOIC8  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
SUFFIX NB  
CASE 751  
STYLE 11  
E4N03  
AYWW G  
G
Rating  
Symbol  
Value  
Unit  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Drain Current  
V
DSS  
30  
V
V
V
GS  
"20  
1
S1 G1 S2 G2  
Continuous @ T = 25°C  
Single Pulse (tp 10 ms)  
I
4.0  
12  
Adc  
Apk  
A
D
I
DM  
E4N03 = Specific Device Code  
Total Power Dissipation  
P
D
2.0  
W
°C  
mJ  
A
Y
WW  
G
= Assembly Location  
= Year  
= Work Week  
@ T = 25°C (Note 1)  
A
Operating and Storage  
Temperature Range  
T , T  
55 to  
+150  
J
stg  
= PbFree Package  
(Note: Microdot may be in either location)  
Single Pulse DraintoSource  
E
AS  
80  
*For additional marking information, refer to  
Application Note AND8002/D.  
Avalanche Energy Starting T = 25°C  
J
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
Peak I = 4.45 Apk, L = 8 mH,  
L
R
G
= 25 W)  
ORDERING INFORMATION  
Thermal Resistance  
R
q
JA  
62.5  
260  
°C/W  
°C  
JunctiontoAmbient (Note 1)  
Device  
Package  
SOIC8  
(PbFree)  
Shipping  
2500 / Tape &  
Reel  
NTMD4N03R2G  
Maximum Lead Temperature for  
T
L
Soldering Purposes for 10 seconds  
NVMD4N03R2G*  
SOIC8  
(PbFree)  
2500 / Tape &  
Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D  
1. When surface mounted to an FR4 board using 1pad size, t 10 s  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
August, 2013 Rev. 4  
NTMD4N03R2/D  
 

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