NTMD6N03R2,
NVMD6N03R2
Power MOSFET
30 V, 6 A, Dual N--Channel SOIC--8
http://onsemi.com
Features
Designed for use in low voltage, high speed switching applications
Ultra Low On--Resistance Provides
V
R
Typ
I Max
D
DSS
DS(ON)
Higher Efficiency and Extends Battery Life
-- R DS(on) = 0.024 Ω, VGS = 10 V (Typ)
30 V
24 mΩ @ V = 10 V
6.0 A
GS
-- R DS(on) = 0.030 Ω, VGS = 4.5 V (Typ)
Miniature SOIC--8 Surface Mount Package Saves Board Space
Diode is Characterized for Use in Bridge Circuits
Diode Exhibits High Speed, with Soft Recovery
AEC Q101 Qualified -- NVMD6N03R2
N--Channel
D
D
These Devices are Pb--Free and are RoHS Compliant
G
G
Applications
S
S
DC--DC Converters
Computers
Printers
MARKING DIAGRAM &
PIN ASSIGNMENT
Cellular and Cordless Phones
Disk Drives and Tape Drives
D1 D1 D2 D2
8
8
1
E6N03
AYWW G
G
SOIC--8
CASE 751
STYLE 11
MAXIMUM RATINGS (T = 25C unless otherwise noted)
J
Rating
Symbol
Value
Unit
1
Drain--to--Source Voltage
Gate--to--Source Voltage -- Continuous
Drain Current
V
30
Volts
Volts
DSS
S1 G1 S2 G2
V
20
GS
E6N03 = Specific Device Code
-- Continuous @ T = 25C
I
6.0
30
Adc
Apk
A
D
A
Y
= Assembly Location
-- Single Pulse (tp 10 ms)
I
DM
= Year
Total Power Dissipation
P
Watts
WW
G
= Work Week
= Pb--Free Package
D
@ T = 25C (Note 1)
2.0
A
@ T = 25C (Note 2)
1.29
A
(Note: Microdot may be in either location)
Operating and Storage Temperature
Range
T , T
J
-- 5 5 t o
+150
C
stg
ORDERING INFORMATION
Single Pulse Drain--to--Source Avalanche
E
325
mJ
AS
Energy -- Starting T = 25C
J
†
(V = 30 Vdc, V = 5.0 Vdc,
Device
Package
Shipping
DD
DS
GS
V
= 20 Vdc, Peak I = 9.0 Apk,
L
L = 10 mH, R = 25 Ω)
G
NTMD6N03R2G
NVMD6N03R2G
SOIC--8
(Pb--Free)
2500 / Tape &
Reel
Thermal Resistance
-- Junction--to--Ambient (Note 1)
-- Junction--to--Ambient (Note 2)
R
θ
C/W
C
JA
62.5
97
SOIC--8
(Pb--Free)
2500 / Tape &
Reel
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
T
260
L
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 pad size, t 10 s
2. When surface mounted to an FR4 board using 1 pad size, t = steady state
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
October, 2011 -- Rev. 3
NTMD6N03R2/D