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NVMFD5852NL_14 PDF预览

NVMFD5852NL_14

更新时间: 2024-09-29 01:13:51
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安森美 - ONSEMI /
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Power MOSFET

NVMFD5852NL_14 数据手册

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NVMFD5852NL  
Power MOSFET  
40 V, 6.9 mW, 44 A, Dual N−Channel Logic  
Level, Dual SO−8FL  
Features  
Small Footprint (5x6 mm) for Compact Designs  
http://onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
NVMFD5852NLWF − Wettable Flanks Option for Enhanced Optical  
Inspection  
AEC−Q101 Qualified and PPAP Capable  
This is a Pb−Free Device  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
6.9 mW @ 10 V  
40 V  
44 A  
12.0 mW @ 4.5 V  
Dual N−Channel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D1  
D2  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
Gate−to−Source Voltage  
V
"20  
44  
V
GS  
Continuous Drain Cur-  
T
= 25°C  
I
A
mb  
D
G1  
G2  
rent R  
(Notes 1,  
Y
J−mb  
T = 100°C  
mb  
31  
2, 3, 4)  
Steady  
State  
S1  
S2  
Power Dissipation  
T
mb  
= 25°C  
P
27  
13  
15  
W
A
D
R
(Notes 1, 2, 3)  
Y
J−mb  
T
mb  
= 100°C  
MARKING DIAGRAM  
Continuous Drain Cur-  
T = 25°C  
I
A
D
D1 D1  
rent R  
& 4)  
(Notes 1, 3  
q
JA  
1
T = 100°C  
A
10.6  
Steady  
State  
S1  
G1  
S2  
G2  
D1  
D1  
D2  
D2  
DFN8 5x6  
(SO8FL)  
CASE 506BT  
5852xx  
AYWZZ  
Power Dissipation  
(Notes 1 & 3)  
T = 25°C  
P
3.2  
1.6  
329  
W
A
D
R
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
D2 D2  
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
5852NL = Specific Device Code  
for NVMFD5852NL  
J
stg  
5852LW = Specific Device Code  
for NVMFD5852NLWF  
Source Current (Body Diode)  
I
40  
80  
A
S
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
A
Y
= Assembly Location  
= Year  
Energy (T = 25°C, V = 10 V, I = 40 A,  
J
GS  
L(pk)  
L = 0.1 mH, R = 25 W)  
G
W
ZZ  
= Work Week  
= Lot Traceability  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
NVMFD5852NLT1G  
DFN8  
(Pb−Free)  
1500 / Tape &  
Reel  
Parameter  
Symbol  
Value  
Unit  
Junction−to−Mounting Board (top) − Steady  
State (Notes 2, 3)  
R
5.6  
Y
J−mb  
NVMFD5852NLWFT1G  
DFN8  
(Pb−Free)  
1500 / Tape &  
Reel  
°C/W  
Junction−to−Ambient − Steady State (Note 3)  
R
47  
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD51−12 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Maximum current for pulses as long as 1 second are higher but are dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 − Rev. 6  
NVMFD5852NL/D  
 

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