NVMFD5852NL
Power MOSFET
40 V, 6.9 mW, 44 A, Dual N−Channel Logic
Level, Dual SO−8FL
Features
• Small Footprint (5x6 mm) for Compact Designs
http://onsemi.com
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• NVMFD5852NLWF − Wettable Flanks Option for Enhanced Optical
Inspection
• AEC−Q101 Qualified and PPAP Capable
• This is a Pb−Free Device
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
6.9 mW @ 10 V
40 V
44 A
12.0 mW @ 4.5 V
Dual N−Channel
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D1
D2
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
Gate−to−Source Voltage
V
"20
44
V
GS
Continuous Drain Cur-
T
= 25°C
I
A
mb
D
G1
G2
rent R
(Notes 1,
Y
J−mb
T = 100°C
mb
31
2, 3, 4)
Steady
State
S1
S2
Power Dissipation
T
mb
= 25°C
P
27
13
15
W
A
D
R
(Notes 1, 2, 3)
Y
J−mb
T
mb
= 100°C
MARKING DIAGRAM
Continuous Drain Cur-
T = 25°C
I
A
D
D1 D1
rent R
& 4)
(Notes 1, 3
q
JA
1
T = 100°C
A
10.6
Steady
State
S1
G1
S2
G2
D1
D1
D2
D2
DFN8 5x6
(SO8FL)
CASE 506BT
5852xx
AYWZZ
Power Dissipation
(Notes 1 & 3)
T = 25°C
P
3.2
1.6
329
W
A
D
R
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
D2 D2
A
p
Operating Junction and Storage Temperature
T , T
−55 to
175
°C
5852NL = Specific Device Code
for NVMFD5852NL
J
stg
5852LW = Specific Device Code
for NVMFD5852NLWF
Source Current (Body Diode)
I
40
80
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
A
Y
= Assembly Location
= Year
Energy (T = 25°C, V = 10 V, I = 40 A,
J
GS
L(pk)
L = 0.1 mH, R = 25 W)
G
W
ZZ
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
†
Device
Package
Shipping
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
NVMFD5852NLT1G
DFN8
(Pb−Free)
1500 / Tape &
Reel
Parameter
Symbol
Value
Unit
Junction−to−Mounting Board (top) − Steady
State (Notes 2, 3)
R
5.6
Y
J−mb
NVMFD5852NLWFT1G
DFN8
(Pb−Free)
1500 / Tape &
Reel
°C/W
Junction−to−Ambient − Steady State (Note 3)
R
47
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Maximum current for pulses as long as 1 second are higher but are dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2014 − Rev. 6
NVMFD5852NL/D