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NVMFD5877NLT3G PDF预览

NVMFD5877NLT3G

更新时间: 2024-11-19 12:49:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 124K
描述
60 V, 39 m, 17 A, Dual N−Channel, Logic Level, Dual SO8FL

NVMFD5877NLT3G 技术参数

是否无铅: 不含铅生命周期:Not Recommended
零件包装代码:DFN包装说明:SMALL OUTLINE, R-PDSO-F6
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.66
雪崩能效等级(Eas):10.5 mJ外壳连接:DRAIN
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):17 A最大漏极电流 (ID):6 A
最大漏源导通电阻:0.06 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):23 W最大脉冲漏极电流 (IDM):74 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NVMFD5877NLT3G 数据手册

 浏览型号NVMFD5877NLT3G的Datasheet PDF文件第2页浏览型号NVMFD5877NLT3G的Datasheet PDF文件第3页浏览型号NVMFD5877NLT3G的Datasheet PDF文件第4页浏览型号NVMFD5877NLT3G的Datasheet PDF文件第5页浏览型号NVMFD5877NLT3G的Datasheet PDF文件第6页 
NVMFD5877NL,  
NVMFD5877NLWF  
Power MOSFET  
60 V, 39 mW, 17 A, Dual NChannel, Logic  
Level, Dual SO8FL  
Features  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
DS(on)  
http://onsemi.com  
NVMFD5877NLWF Wettable Flanks Product  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
39 mW @ 10 V  
60 mW @ 4.5 V  
60 V  
17 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
Dual NChannel  
V
DSS  
D1  
D2  
GatetoSource Voltage  
V
"20  
17  
V
GS  
Continuous Drain Cur-  
T
= 25°C  
= 100°C  
= 25°C  
I
A
mb  
D
rent R  
(Notes 1,  
Y
Jmb  
T
mb  
12  
2, 3, 4)  
Steady  
State  
G1  
G2  
Power Dissipation  
T
mb  
P
23  
W
A
D
R
(Notes 1, 2, 3)  
Y
Jmb  
T
mb  
= 100°C  
12  
S1  
S2  
Continuous Drain Cur-  
T = 25°C  
I
6
A
D
rent R  
3, 4)  
(Notes 1 &  
MARKING DIAGRAM  
q
JA  
T = 100°C  
A
5
Steady  
State  
D1 D1  
Power Dissipation  
(Notes 1, 3)  
T = 25°C  
P
3.2  
1.6  
74  
W
A
D
S1  
G1  
S2  
G2  
D1  
D1  
D2  
D2  
R
1
q
JA  
5877xx  
AYWZZ  
T = 100°C  
A
DFN8 5x6  
(SO8FL)  
CASE 506BT  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D2 D2  
Operating Junction and Storage Temperature  
T , T  
55 to  
+175  
°C  
J
stg  
5877NL = Specific Device Code  
for NVMFD5877NL  
Source Current (Body Diode)  
I
S
19  
A
5877LW = Specific Device Code  
for NVMFD5877NLWF  
Single Pulse Drain−  
toSource Avalanche  
(I  
= 14.5 A, L =  
E
10.5  
mJ  
L(pk)  
AS  
0.1 mH)  
A
Y
= Assembly Location  
= Year  
Energy (T = 25°C,  
J
(I = 6.3 A, L =  
40  
V
= 24 V, V  
G
=
L(pk)  
DD  
GS  
2 mH)  
W
ZZ  
= Work Week  
= Lot Traceability  
10 V, R = 25 W)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NVMFD5877NLT1G  
NVMFD5877NLWFT1G  
NVMFD5877NLT3G  
NVMFD5877NLWFT3G  
DFN8  
(PbFree)  
1500 / Tape &  
Reel  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
Unit  
DFN8  
(PbFree)  
1500 / Tape &  
Reel  
JunctiontoMounting Board (top) Steady  
State (Note 2, 3)  
R
6.5  
°C/W  
Y
Jmb  
DFN8  
(PbFree)  
5000 / Tape &  
Reel  
JunctiontoAmbient Steady State (Note 3)  
R
47  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
DFN8  
(PbFree)  
5000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
November, 2013 Rev. 8  
NVMFD5877NL/D  
 

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