NVMFD5853NL,
NVMFD5853NLWF
Power MOSFET
40 V, 10 mW, 34 A, Dual N−Channel Logic
Level, Dual SO−8FL
Features
http://onsemi.com
• Small Footprint (5x6 mm) for Compact Designs
• Low R
to Minimize Conduction Losses
DS(on)
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• Low Capacitance to Minimize Driver Losses
• NVMFD5853NLWF − Wettable Flanks Product
• AEC−Q101 Qualified and PPAP Capable
• This is a Pb−Free Device
10 mW @ 10 V
15 mW @ 4.5 V
40 V
34 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Dual N−Channel
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
D1
D2
V
DSS
Gate−to−Source Voltage
V
"20
34
V
GS
Continuous Drain Cur-
T
= 25°C
I
A
mb
D
rent R
(Notes 1,
G1
G2
Y
J−mb
T = 100°C
mb
24
2, 3, 4)
Steady
State
Power Dissipation
T
mb
= 25°C
P
24
12
12
W
A
D
S1
S2
R
(Notes 1, 2, 3)
Y
J−mb
T
mb
= 100°C
Continuous Drain Cur-
T = 25°C
I
MARKING DIAGRAM
A
D
rent R
& 4)
(Notes 1, 3
q
JA
D1 D1
T = 100°C
A
8.5
Steady
State
1
S1
G1
S2
G2
D1
D1
D2
D2
Power Dissipation
(Notes 1 & 3)
T = 25°C
P
3.0
1.5
165
W
A
D
DFN8 5x6
(SO8FL)
CASE 506BT
5853xx
AYWZZ
R
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
D2 D2
Operating Junction and Storage Temperature
T , T
−55 to
°C
J
stg
175
5853NL = Specific Device Code
for NVMFD5853NL
5853LW = Specific Device Code
for NVMFD5853NLWF
Source Current (Body Diode)
I
S
34
40
A
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (T = 25°C, V = 10 V, I = 28.3 A,
J
GS
L(pk)
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
L = 0.1 mH, R = 25 W)
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Device
Package
Shipping
Parameter
Symbol
Value
Unit
NVMFD5853NLT1G
DFN8
(Pb−Free)
1500 / Tape &
Reel
Junction−to−Mounting Board (top) − Steady
R
6.2
Y
J−mb
State (Notes 2, 3)
NVMFD5853NLWFT1G
DFN8
(Pb−Free)
1500 / Tape &
Reel
Junction−to−Ambient − Steady State (Note 3)
51
°C/W
R
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction−to−Ambient − Steady State (min foot-
q
JA
162
print)
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second are higher but are dependent on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 3
NVMFD5853NL/D