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NVMFD5853NL PDF预览

NVMFD5853NL

更新时间: 2024-09-28 12:26:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 126K
描述
Power MOSFET 40 V, 10 m, 34 A, Dual N.Channel Logic Level, Dual SO.8FL

NVMFD5853NL 数据手册

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NVMFD5853NL,  
NVMFD5853NLWF  
Power MOSFET  
40 V, 10 mW, 34 A, Dual NChannel Logic  
Level, Dual SO8FL  
Features  
http://onsemi.com  
Small Footprint (5x6 mm) for Compact Designs  
Low R  
to Minimize Conduction Losses  
DS(on)  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Low Capacitance to Minimize Driver Losses  
NVMFD5853NLWF Wettable Flanks Product  
AECQ101 Qualified and PPAP Capable  
This is a PbFree Device  
10 mW @ 10 V  
15 mW @ 4.5 V  
40 V  
34 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Dual NChannel  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D1  
D2  
V
DSS  
GatetoSource Voltage  
V
"20  
34  
V
GS  
Continuous Drain Cur-  
T
= 25°C  
I
A
mb  
D
rent R  
(Notes 1,  
G1  
G2  
Y
Jmb  
T = 100°C  
mb  
24  
2, 3, 4)  
Steady  
State  
Power Dissipation  
T
mb  
= 25°C  
P
24  
12  
12  
W
A
D
S1  
S2  
R
(Notes 1, 2, 3)  
Y
Jmb  
T
mb  
= 100°C  
Continuous Drain Cur-  
T = 25°C  
I
MARKING DIAGRAM  
A
D
rent R  
& 4)  
(Notes 1, 3  
q
JA  
D1 D1  
T = 100°C  
A
8.5  
Steady  
State  
1
S1  
G1  
S2  
G2  
D1  
D1  
D2  
D2  
Power Dissipation  
(Notes 1 & 3)  
T = 25°C  
P
3.0  
1.5  
165  
W
A
D
DFN8 5x6  
(SO8FL)  
CASE 506BT  
5853xx  
AYWZZ  
R
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D2 D2  
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
stg  
175  
5853NL = Specific Device Code  
for NVMFD5853NL  
5853LW = Specific Device Code  
for NVMFD5853NLWF  
Source Current (Body Diode)  
I
S
34  
40  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (T = 25°C, V = 10 V, I = 28.3 A,  
J
GS  
L(pk)  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
L = 0.1 mH, R = 25 W)  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Device  
Package  
Shipping  
Parameter  
Symbol  
Value  
Unit  
NVMFD5853NLT1G  
DFN8  
(PbFree)  
1500 / Tape &  
Reel  
JunctiontoMounting Board (top) Steady  
R
6.2  
Y
Jmb  
State (Notes 2, 3)  
NVMFD5853NLWFT1G  
DFN8  
(PbFree)  
1500 / Tape &  
Reel  
JunctiontoAmbient Steady State (Note 3)  
51  
°C/W  
R
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
JunctiontoAmbient Steady State (min foot-  
q
JA  
162  
print)  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second are higher but are dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
April, 2013 Rev. 3  
NVMFD5853NL/D  
 

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