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NVMFD5C462NLT1G PDF预览

NVMFD5C462NLT1G

更新时间: 2024-11-20 11:10:35
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲光电二极管晶体管
页数 文件大小 规格书
7页 228K
描述
双 N 沟道,功率 MOSFET,40V,84A,4.7mΩ

NVMFD5C462NLT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F6Reach Compliance Code:not_compliant
Factory Lead Time:8 weeks风险等级:1.47
雪崩能效等级(Eas):174 mJ外壳连接:DRAIN
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏源导通电阻:0.0077 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F6JESD-609代码:e3
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):50 W
最大脉冲漏极电流 (IDM):311 A参考标准:AEC-Q101
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
晶体管元件材料:SILICONBase Number Matches:1

NVMFD5C462NLT1G 数据手册

 浏览型号NVMFD5C462NLT1G的Datasheet PDF文件第2页浏览型号NVMFD5C462NLT1G的Datasheet PDF文件第3页浏览型号NVMFD5C462NLT1G的Datasheet PDF文件第4页浏览型号NVMFD5C462NLT1G的Datasheet PDF文件第5页浏览型号NVMFD5C462NLT1G的Datasheet PDF文件第6页浏览型号NVMFD5C462NLT1G的Datasheet PDF文件第7页 
NVMFD5C462NL  
MOSFET – Power, Dual  
N-Channel  
40 V, 4.7 mW, 84 A  
Features  
Small Footprint (5x6 mm) for Compact Design  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
NVMFD5C462NLWF Wettable Flank Option for Enhanced Optical  
Inspection  
4.7 m@ 10 V  
7.7 m@ 4.5 V  
40 V  
84 A  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
Dual NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D1  
D2  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
G1  
G2  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
84  
A
C
D
JC  
T
C
52  
(Notes 1, 2, 3)  
Steady  
State  
S1  
S2  
Power Dissipation  
T
C
P
50  
W
A
D
R
(Notes 1, 2)  
JC  
T
C
= 100°C  
25  
MARKING  
DIAGRAM  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
18  
JA  
T = 100°C  
A
15  
(Notes 1, 2, 3)  
Steady  
State  
D1 D1  
S1  
G1  
S2  
G2  
D1  
Power Dissipation  
T = 25°C  
A
P
3.0  
2.1  
311  
W
D
1
R
(Notes 1 & 2)  
D1  
D2  
D2  
XXXXXX  
AYWZZ  
JA  
DFN8 5x6  
(SO8FL)  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 s  
I
DM  
A
A
p
CASE 506BT  
D2 D2  
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
stg  
+ 175  
A
Y
= Assembly Location  
= Year  
Source Current (Body Diode)  
I
S
56  
A
W
ZZ  
= Work Week  
= Lot Traceability  
Single Pulse DraintoSource Avalanche  
E
AS  
174  
mJ  
Energy (T = 25°C, I  
= 5 A)  
J
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
2.25  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
JC  
R
47.3  
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
July, 2019 Rev. P3  
NVMFD5C462NL/D  
 

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