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NVMFD5C446NT1G

更新时间: 2024-11-20 11:13:07
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安森美 - ONSEMI /
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描述
双 N 沟道功率 MOSFET 40V,127A, 2.9mΩ

NVMFD5C446NT1G 数据手册

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NVMFD5C446N  
Power MOSFET  
40 V, 2.9 mW, 127 A, Dual N−Channel  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
NVMFD5C446NWF − Wettable Flank Option for Enhanced Optical  
Inspection  
AEC−Q101 Qualified and PPAP Capable  
These Devices are Pb−Free and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
40 V  
2.9 m@ 10 V  
127 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
40  
Unit  
V
Dual N−Channel  
V
DSS  
D1  
D2  
Gate−to−Source Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
(Notes 1, 2, 3)  
T
= 25°C  
= 100°C  
= 25°C  
I
127  
90  
A
C
D
JC  
T
C
Steady  
State  
G1  
G2  
Power Dissipation  
T
C
P
89  
W
A
D
R
(Notes 1, 2)  
JC  
T
C
= 100°C  
44  
S1  
S2  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
24  
JA  
T = 100°C  
A
17  
(Notes 1, 2, 3)  
Steady  
State  
MARKING  
DIAGRAM  
Power Dissipation  
T = 25°C  
A
P
3.2  
1.6  
637  
W
D
R
(Notes 1 & 2)  
JA  
T = 100°C  
A
D1 D1  
S1  
G1  
S2  
G2  
D1  
Pulsed Drain Current  
T = 25°C, t = 10 s  
I
DM  
A
A
p
1
D1  
D2  
D2  
XXXXXX  
AYWZZ  
DFN8 5x6  
(SO8FL)  
CASE 506BT  
Operating Junction and Storage Temperature  
T , T  
55 to  
+ 175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
74  
A
D2 D2  
Single Pulse Drain−to−Source Avalanche  
E
223  
mJ  
AS  
XXXXXX = 5C446N (NVMFD5C446N)  
Energy (T = 25°C, I  
= 11 A)  
J
L(pk)  
= or 446NWF (NVMFD5C446NWF)  
= Assembly Location  
= Year  
A
Y
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
W
ZZ  
= Work Week  
= Lot Traceability  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
Parameter  
Symbol  
Value  
1.7  
Unit  
Junction−to−Case − Steady State  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
JC  
JA  
R
47  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
October, 2017 − Rev. 1  
NVMFD5C446NL/D  
 

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