NVMFD5877NL,
NVMFD5877NLWF
Power MOSFET
60 V, 39 mW, 17 A, Dual N−Channel, Logic
Level, Dual SO8FL
Features
• Low R
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
DS(on)
http://onsemi.com
• NVMFD5877NLWF − Wettable Flanks Product
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
39 mW @ 10 V
60 mW @ 4.5 V
60 V
17 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
Dual N−Channel
V
DSS
D1
D2
Gate−to−Source Voltage
V
"20
17
V
GS
Continuous Drain Cur-
T
= 25°C
= 100°C
= 25°C
I
A
mb
D
rent R
(Notes 1,
Y
J−mb
T
mb
12
2, 3, 4)
Steady
State
G1
G2
Power Dissipation
T
mb
P
23
W
A
D
R
(Notes 1, 2, 3)
Y
J−mb
T
mb
= 100°C
12
S1
S2
Continuous Drain Cur-
T = 25°C
I
6
A
D
rent R
3, 4)
(Notes 1 &
MARKING DIAGRAM
q
JA
T = 100°C
A
5
Steady
State
D1 D1
Power Dissipation
(Notes 1, 3)
T = 25°C
P
3.2
1.6
74
W
A
D
S1
G1
S2
G2
D1
D1
D2
D2
R
1
q
JA
5877xx
AYWZZ
T = 100°C
A
DFN8 5x6
(SO8FL)
CASE 506BT
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
D2 D2
Operating Junction and Storage Temperature
T , T
−55 to
+175
°C
J
stg
5877NL = Specific Device Code
for NVMFD5877NL
Source Current (Body Diode)
I
S
19
A
5877LW = Specific Device Code
for NVMFD5877NLWF
Single Pulse Drain−
to−Source Avalanche
(I
= 14.5 A, L =
E
10.5
mJ
L(pk)
AS
0.1 mH)
A
Y
= Assembly Location
= Year
Energy (T = 25°C,
J
(I = 6.3 A, L =
40
V
= 24 V, V
G
=
L(pk)
DD
GS
2 mH)
W
ZZ
= Work Week
= Lot Traceability
10 V, R = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
NVMFD5877NLT1G
NVMFD5877NLWFT1G
NVMFD5877NLT3G
NVMFD5877NLWFT3G
DFN8
(Pb−Free)
1500 / Tape &
Reel
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
Unit
DFN8
(Pb−Free)
1500 / Tape &
Reel
Junction−to−Mounting Board (top) − Steady
State (Note 2, 3)
R
6.5
°C/W
Y
J−mb
DFN8
(Pb−Free)
5000 / Tape &
Reel
Junction−to−Ambient − Steady State (Note 3)
R
47
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
DFN8
(Pb−Free)
5000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
November, 2013 − Rev. 8
NVMFD5877NL/D