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NVMFD5C466NT1G

更新时间: 2024-11-17 11:11:39
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安森美 - ONSEMI /
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描述
双 N 沟道功率 MOSFET 40 V,46 A,8.1 mΩ

NVMFD5C466NT1G 数据手册

 浏览型号NVMFD5C466NT1G的Datasheet PDF文件第2页浏览型号NVMFD5C466NT1G的Datasheet PDF文件第3页浏览型号NVMFD5C466NT1G的Datasheet PDF文件第4页浏览型号NVMFD5C466NT1G的Datasheet PDF文件第5页浏览型号NVMFD5C466NT1G的Datasheet PDF文件第6页浏览型号NVMFD5C466NT1G的Datasheet PDF文件第7页 
NVMFD5C466N  
MOSFET – Power, Dual  
N-Channel  
40 V, 8.1 mW, 49 A  
Features  
Small Footprint (5x6 mm) for Compact Design  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
NVMFD5C466NWF Wettable Flank Option for Enhanced Optical  
Inspection  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
40 V  
8.1 m@ 10 V  
49 A  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
Dual NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D1  
D2  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
I
49  
A
C
D
G1  
G2  
JC  
T
C
= 100°C  
35  
(Notes 1, 2, 3)  
Steady  
State  
S1  
S2  
Power Dissipation  
T
C
= 25°C  
P
38  
19  
14  
W
A
D
R
(Notes 1, 2)  
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
MARKING  
DIAGRAM  
JA  
T = 100°C  
A
10  
(Notes 1, 2, 3)  
Steady  
State  
D1 D1  
Power Dissipation  
T = 25°C  
A
P
3.0  
1.5  
169  
W
D
S1  
G1  
S2  
G2  
D1  
R
(Notes 1 & 2)  
1
JA  
T = 100°C  
A
D1  
D2  
D2  
XXXXXX  
AYWZZ  
DFN8 5x6  
(SO8FL)  
Pulsed Drain Current  
T = 25°C, t = 10 s  
I
DM  
A
A
p
CASE 506BT  
Operating Junction and Storage Temperature  
T , T  
55 to  
+ 175  
°C  
J
stg  
D2 D2  
XXXXXX = 5C466N (NVMFD5C466N)  
Source Current (Body Diode)  
I
31  
72  
A
S
= or 466NWF (NVMFD5C466NWF)  
= Assembly Location  
= Year  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
A
Y
Energy (T = 25°C, I  
= 3 A)  
J
L(pk)  
W
ZZ  
= Work Week  
= Lot Traceability  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
JunctiontoCase Steady State  
R
4
°C/W  
JC  
JunctiontoAmbient Steady State (Note 2)  
R
49  
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
July, 2019 Rev. 1  
NVMFD5C466N/D  
 

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