NVMFD5C466N
MOSFET – Power, Dual
N-Channel
40 V, 8.1 mW, 49 A
Features
• Small Footprint (5x6 mm) for Compact Design
www.onsemi.com
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
• NVMFD5C466NWF − Wettable Flank Option for Enhanced Optical
Inspection
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
40 V
8.1 mꢂ @ 10 V
49 A
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Dual N−Channel
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
D1
D2
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
I
49
A
C
D
G1
G2
ꢀ
JC
T
C
= 100°C
35
(Notes 1, 2, 3)
Steady
State
S1
S2
Power Dissipation
T
C
= 25°C
P
38
19
14
W
A
D
R
(Notes 1, 2)
ꢀ
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
MARKING
DIAGRAM
ꢀ
JA
T = 100°C
A
10
(Notes 1, 2, 3)
Steady
State
D1 D1
Power Dissipation
T = 25°C
A
P
3.0
1.5
169
W
D
S1
G1
S2
G2
D1
R
(Notes 1 & 2)
1
ꢀ
JA
T = 100°C
A
D1
D2
D2
XXXXXX
AYWZZ
DFN8 5x6
(SO8FL)
Pulsed Drain Current
T = 25°C, t = 10 ꢁ s
I
DM
A
A
p
CASE 506BT
Operating Junction and Storage Temperature
T , T
−55 to
+ 175
°C
J
stg
D2 D2
XXXXXX = 5C466N (NVMFD5C466N)
Source Current (Body Diode)
I
31
72
A
S
= or 466NWF (NVMFD5C466NWF)
= Assembly Location
= Year
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
A
Y
Energy (T = 25°C, I
= 3 A)
J
L(pk)
W
ZZ
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Junction−to−Case − Steady State
R
4
°C/W
ꢀ
JC
Junction−to−Ambient − Steady State (Note 2)
R
49
ꢀ
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
July, 2019 − Rev. 1
NVMFD5C466N/D