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NVMFD5C668NLWFT1G PDF预览

NVMFD5C668NLWFT1G

更新时间: 2024-09-30 11:11:15
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 227K
描述
功率 MOSFET,60V,68 A,6.5 mΩ,双 N 沟道

NVMFD5C668NLWFT1G 数据手册

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NVMFD5C668NL  
MOSFET – Power, Dual  
N-Channel  
60 V, 6.5 mW, 68 A  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
NVMFD5C668NLWF Wettable Flank Option for Enhanced Optical  
Inspection  
6.5 mW @ 10 V  
9.2 mW @ 4.5 V  
60 V  
68 A  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
Dual NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D1  
D2  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
20  
V
GS  
G1  
G2  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
68  
A
C
D
q
JC  
T
C
48  
(Notes 1, 2, 3)  
S1  
S2  
Steady  
State  
Power Dissipation  
T
C
P
57.5  
29  
W
A
D
R
(Notes 1, 2)  
q
JC  
T
C
= 100°C  
MARKING  
DIAGRAM  
Continuous Drain  
Current R  
T = 25°C  
A
I
15.5  
11  
D
q
JA  
D1 D1  
T = 100°C  
A
(Notes 1, 2, 3)  
Steady  
State  
S1  
G1  
S2  
G2  
D1  
1
Power Dissipation  
T = 25°C  
A
P
3.0  
1.5  
454  
W
D1  
D2  
D2  
D
XXXXXX  
AYWZZ  
DFN8 5x6  
(SO8FL)  
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
CASE 506BT  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
A
A
p
DM  
D2 D2  
Operating Junction and Storage Temperature  
T , T  
55 to  
+ 175  
°C  
J
stg  
XXXXXX = 5C668L (NVMFD5C668NL) or  
668LWF (NVMFD5C668NLWF)  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
Source Current (Body Diode)  
I
48  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
205  
mJ  
Energy (T = 25°C, I  
= 3.22 A)  
J
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
2.6  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
50.26  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
July, 2019 Rev. 0  
NVMFD5C668NL/D  
 

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