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NTTFS4951N

更新时间: 2024-11-19 01:14:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 122K
描述
Single N−Channel Power MOSFET

NTTFS4951N 数据手册

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NTTFS4951N  
Power MOSFET  
30 V, 46 A, Single NChannel, m8FL  
Features  
Optimized for Portable Applications with 5 V Gate Drive  
Low R  
to Minimize Conduction Losses  
DS(on)  
http://onsemi.com  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
6.2 mW @ 10 V  
9.0 mW @ 4.5 V  
30 V  
46 A  
Applications  
DCDC Converters  
Power Load Switch  
Notebook Battery Management  
NChannel MOSFET  
D (58)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
DSS  
30  
20  
V
V
A
G (4)  
GatetoSource Voltage  
V
GS  
Continuous Drain  
I
D
T = 25°C  
13.5  
9.7  
A
Current R  
(Note 1)  
q
JA  
S (1,2,3)  
T = 85°C  
A
Power Dissipation R  
(Note 1)  
T = 25°C  
P
2.19  
W
A
q
A
D
JA  
MARKING DIAGRAM  
1
Continuous Drain  
I
D
T = 25°C  
A
19  
1
Current R  
(Note 1)  
10 s  
S
S
S
G
D
D
D
D
q
JA  
T = 85°C  
A
13.7  
4.42  
4951  
AYWWG  
G
WDFN8  
(m8FL)  
CASE 511AB  
Power Dissipation  
10 s (Note 1)  
T = 25°C  
A
P
I
W
A
D
D
D
R
Steady  
State  
q
JA  
Continuous Drain  
Current R (Note 2)  
T = 25°C  
A
8.3  
6.0  
D
4951  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
q
JA  
T = 85°C  
A
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
I
0.84  
W
A
R
q
JA  
WW  
G
= Work Week  
= PbFree Package  
Continuous Drain  
Current R (Note 1)  
T
C
T
C
T
C
= 25°C  
= 85°C  
= 25°C  
46  
33  
D
q
JC  
(Note: Microdot may be in either location)  
Power Dissipation  
(Note 1)  
P
25.5  
W
R
q
JC  
ORDERING INFORMATION  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
140  
A
A
p
Device  
Package  
Shipping  
Operating Junction and Storage Temperature  
T ,  
stg  
55 to  
+150  
°C  
J
T
NTTFS4951NTAG  
WDFN8 1500/Tape & Reel  
(PbFree)  
Source Current (Body Diode)  
I
29  
6.0  
42  
A
S
Drain to Source dV/dt  
dV/dt  
V/ns  
mJ  
NTTFS4951NTWG WDFN8 5000/Tape & Reel  
(PbFree)  
Single Pulse DraintoSource Avalanche Energy  
E
AS  
(T = 25°C, V = 50 V, V = 10 V,  
J
DD  
GS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
I = 29 A , L = 0.1 mH, R = 25 W)  
L
pk  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
January, 2014 Rev. 1  
NTTFS4951N/D  
 

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