NTTFS4951N
Power MOSFET
30 V, 46 A, Single N−Channel, m8FL
Features
• Optimized for Portable Applications with 5 V Gate Drive
• Low R
to Minimize Conduction Losses
DS(on)
http://onsemi.com
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
6.2 mW @ 10 V
9.0 mW @ 4.5 V
30 V
46 A
Applications
• DC−DC Converters
• Power Load Switch
• Notebook Battery Management
N−Channel MOSFET
D (5−8)
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol Value Unit
V
DSS
30
20
V
V
A
G (4)
Gate−to−Source Voltage
V
GS
Continuous Drain
I
D
T = 25°C
13.5
9.7
A
Current R
(Note 1)
q
JA
S (1,2,3)
T = 85°C
A
Power Dissipation R
(Note 1)
T = 25°C
P
2.19
W
A
q
A
D
JA
MARKING DIAGRAM
1
Continuous Drain
I
D
T = 25°C
A
19
1
Current R
(Note 1)
≤ 10 s
S
S
S
G
D
D
D
D
q
JA
T = 85°C
A
13.7
4.42
4951
AYWWG
G
WDFN8
(m8FL)
CASE 511AB
Power Dissipation
≤ 10 s (Note 1)
T = 25°C
A
P
I
W
A
D
D
D
R
Steady
State
q
JA
Continuous Drain
Current R (Note 2)
T = 25°C
A
8.3
6.0
D
4951
A
Y
= Specific Device Code
= Assembly Location
= Year
q
JA
T = 85°C
A
Power Dissipation
(Note 2)
T = 25°C
A
P
I
0.84
W
A
R
q
JA
WW
G
= Work Week
= Pb−Free Package
Continuous Drain
Current R (Note 1)
T
C
T
C
T
C
= 25°C
= 85°C
= 25°C
46
33
D
q
JC
(Note: Microdot may be in either location)
Power Dissipation
(Note 1)
P
25.5
W
R
q
JC
ORDERING INFORMATION
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
140
A
A
p
†
Device
Package
Shipping
Operating Junction and Storage Temperature
T ,
stg
−55 to
+150
°C
J
T
NTTFS4951NTAG
WDFN8 1500/Tape & Reel
(Pb−Free)
Source Current (Body Diode)
I
29
6.0
42
A
S
Drain to Source dV/dt
dV/dt
V/ns
mJ
NTTFS4951NTWG WDFN8 5000/Tape & Reel
(Pb−Free)
Single Pulse Drain−to−Source Avalanche Energy
E
AS
(T = 25°C, V = 50 V, V = 10 V,
J
DD
GS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
I = 29 A , L = 0.1 mH, R = 25 W)
L
pk
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
January, 2014 − Rev. 1
NTTFS4951N/D