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NTMFS5H419NLT1G PDF预览

NTMFS5H419NLT1G

更新时间: 2024-11-03 11:13:55
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲光电二极管晶体管
页数 文件大小 规格书
7页 216K
描述
单 N 沟道,功率 MOSFET,40V,150A,2.1mΩ

NTMFS5H419NLT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F5Reach Compliance Code:not_compliant
Factory Lead Time:4 weeks风险等级:1.51
雪崩能效等级(Eas):375 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):155 A最大漏极电流 (ID):155 A
最大漏源导通电阻:0.0031 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):89 W
最大脉冲漏极电流 (IDM):900 A表面贴装:YES
端子面层:Tin (Sn)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

NTMFS5H419NLT1G 数据手册

 浏览型号NTMFS5H419NLT1G的Datasheet PDF文件第2页浏览型号NTMFS5H419NLT1G的Datasheet PDF文件第3页浏览型号NTMFS5H419NLT1G的Datasheet PDF文件第4页浏览型号NTMFS5H419NLT1G的Datasheet PDF文件第5页浏览型号NTMFS5H419NLT1G的Datasheet PDF文件第6页浏览型号NTMFS5H419NLT1G的Datasheet PDF文件第7页 
NTMFS5H419NL  
MOSFET – Power, Single,  
N-Channel  
40 V, 2.1 mW, 155 A  
Features  
Small Footprint (5x6 mm) for Compact Design  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
These Devices are PbFree and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
2.1 mW @ 10 V  
3.1 mW @ 4.5 V  
40 V  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
155 A  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
D (5)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
155  
98  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
89  
W
A
G (4)  
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
36  
S (1,2,3)  
NCHANNEL MOSFET  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
29  
q
JA  
T = 100°C  
A
18  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.1  
1.3  
900  
W
D
R
(Notes 1, 2)  
q
JA  
MARKING  
DIAGRAM  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
1
J
stg  
S
S
S
G
D
D
+ 150  
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
5H419L  
AYWZZ  
Source Current (Body Diode)  
I
S
74  
A
Single Pulse DraintoSource Avalanche  
E
AS  
375  
mJ  
D
Energy (I  
= 14 A)  
L(pk)  
5H419L = Specific Device Code  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
A
Y
= Assembly Location  
= Year  
(1/8from case for 10 s)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
ZZ  
= Work Week  
= Lot Traceability  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
1.4  
Unit  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
40  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
May, 2019 Rev. 1  
NTMFS5H419NL/D  
 

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