NSB1706DMW5T1
Dual Bias Resistor
Transistor
NPN Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
http://onsemi.com
The BRT (Bias Resistor Transistor) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the NSB1706DMW5T1, two
BRT devices are housed in the SC−88A package which is ideal for low
power surface mount applications where board space is at a premium.
(5)
Q1
(4)
Q2
R2
R2
Features
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Pb−Free Package is Available
R1
R1
(1)
(2)
(3)
MAXIMUM RATINGS
(T = 25°C unless otherwise noted, common for Q and Q )
A
1
2
Rating
Symbol
Value
50
Unit
Vdc
1
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
V
V
CBO
CEO
50
Vdc
SC−88A
CASE 419A
STYLE 1
I
100
mAdc
C
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
MARKING DIAGRAM
Total Device Dissipation
P
187 (Note 1)
256 (Note 2)
1.5 (Note 1) mW/°C
2.0 (Note 2)
mW
D
T = 25°C
A
Derate above 25°C
U6 M G
Thermal Resistance, Junction-to-Ambient
R
q
JA
670 (Note 1)
490 (Note 2)
°C/W
G
1
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
U6 = Device Marking
Total Device Dissipation
P
250 (Note 1)
385 (Note 2)
2.0 (Note 1) mW/°C
3.0 (Note 2)
mW
D
M
= Date Code
T = 25°C
A
G
= Pb−Free Package
(Note: Microdot may be in either location)
Derate above 25°C
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Lead
Junction and Storage Temperature
R
493 (Note 1)
325 (Note 2)
°C/W
°C/W
°C
q
JA
ORDERING INFORMATION
†
R
188 (Note 1)
208 (Note 2)
q
JL
Device
Package
Shipping
NSB1706DMW5T1
SC−88A 3000/Tape & Reel
T , T
J
−55 to +150
stg
NSB1706DMW5T1G SC−88A 3000/Tape & Reel
(Pb−Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2. FR−4 @ 1.0 x 1.0 inch Pad.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
May, 2006 − Rev. 3
NSB1706DMW5T1/D