MwT-H7
28 GHz Medium Power/ High Gain
AlGaAs/InGaAs PHEMT
DOWNLOAD ADDITIONAL DATA WWW.MWTINC.COM
All Dimensions in Microns
FEATURES
50
50
• 21.5 dBm POWER OUTPUT AT 12 GHz
• EXCELLENT FOR HIGH GAIN AND MEDIUM POWER
APPLICATIONS
70
241
100
• 0.3 MICRON REFRACTORY METAL/GOLD GATE
• 250 MICRON GATE WIDTH
• CHOICE OF CHIP AND TWO PACKAGE TYPES
50
50 50
50
356
CHIP THICKNESS = 125 MICRONS
DESCRIPTION
The MwT-H7 is an AlGaAs/InGaAs heterojunction PHEMT (Pseudomorphic-High-Electron-Mobility Transistor) device whose nominal 0.3
micron gate length and 250 micron gate width make it ideally suited to applications requiring high-gain and medium power in the 500
MHz to 28 GHz frequency range. The device is equally effective for either wideband (e.g. 6-18 GHz) or narrow-band applications. The
chip is produced using MwT’s reliable metal system and all devices are screened to insure reliability. All chips are passivated using MwT’s
patented “Diamond-Like Carbon” process for increased durability.
DC SPECIFICATIONS AT Ta = 25°C
RF SPECIFICATIONS AT Ta = 25°C
SYMBOL
PARAM. & CONDITIONS
UNITS
MIN
TYP
MAX
SYMBOL
PARAMETERS AND CONDITIONS
FREQ
UNITS
MIN TYP
Output Power at 1 dB Compression
VDS= 5.0 V Idss= 50mA IDS=0.8
12 GHz
dBm
21.5
Saturated Drain Current
Vds= 3.0 V VGS= 0.0 V
Transconductance
20.0
P1dB
IDSS
mA
34
106
Small Signal Gain
VDS= 5.0 V Idss= 50mA IDS=0.8
Gm
mS
V
50
75
SSG
11.0
12.0
2.0
dB
dB
12 GHz
12 GHz
Vds= 3.0 V VGS= 0.0 V
Pinch-off Voltage
Optimum Noise Figure
VDS= 3.0 V IDS= 10mA
-1.5
-8.0
Vp
-5.0
NFopt
Vds= 3.0 V IDS= 1.0 mA
Gate-to-Source Breakdown Volt.
Igs= -0.4mA, Igd= 0
Gain at Optimum Noise Figure
VDS= 3.0 V IDS= 10mA
BVGSO
V
-5.0
-6.0
GA
12 GHz
%
10.0
Gate-to-Drain Breakdown Volt.
Igd= -0.4 mA, Igs= 0
BVGDO
Rth
V
Recommended IDSS Range
for Optimum P1dB
-8.0
50-
86
Idss
mA
Thermal
Resistance MwT -H770, H773
180-
380
MwT-H7 Chip
°C/W
PARAMETER
DEVICE EQUIVALENT CIRCUIT MODEL
VALUE
2.6 Ω
Source Resistance
Rs
Source Inductance
Ls
0.025
nH
Ω
pF
Ω
pF
nH
nH
pF
Ω
pF
Ω
pF
mS
psec
Cgd
Lg
Rg
Rd
Ld
Drain-Source Resistance
Drain-Source Capacitance
Drain Resistance
Drain Pad Capacitance
Drain Inductance
Gate Bond Wire Inductance
Gate Pad Capacitance
Gate Resistance
Gate-Source Capacitance
Channel Resistance
Gate-Drain Capacitance
Transconductance
Rds
Cds
Rd
Cpd
Ld
Lg
Cpg
Rg
Cgs
Ri
Cgd
gm
tau
400.0
0.070
3.67
0.027
0.159
0.089
0.050
0.20
0.4
DRAIN
Cgs
Ri
GATE
Rds
gm
tau
Cds
Cpd
Cpg
Rs
Ls
6.9
0.04
85.0
3.02
SOURCE
Transit Time
ORDERING INFORMATION
Chip
MwT-H7
NOTE:
Package 70
Package 73
MwT-H770
MwT-H773
For Package information, please see the Fapp0002 note from our website at www.mwtinc.com.
When placing order or inquiring, please specify BIN range, wafer no., if known, and screening
level required.
4268 Solar Way Fremont California 94538 Phone: (510) 651-6700 Fax: (510) 651-2208
All rights reserved. MicroWave Technology, Inc. All specifications subject to change without notice.