Document Number: MRF6S23100H
Rev. 0, 8/2005
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
Designed for 802.16 WiBro and dual mode applications with frequencies
from 2300 to 2400 MHz. Suitable for Class AB feedforward and predistortion
systems.
MRF6S23100HR3
MRF6S23100HSR3
• Typical 2-Carrier W-CDMA Performance: VDD = 28 Volts, IDQ = 1000 mA,
P
out = 20 Watts Avg., Full Frequency Band, Channel Bandwidth =
3.84 MHz, PAR = 8.5 dB @ 0.01% Probability on CCDF.
Power Gain — 15.4 dB
2300-2400 MHz, 20 W AVG., 28 V
2 x W-CDMA
Drain Efficiency — 23.5%
IM3 @ 10 MHz Offset — -37 dBc @ 3.84 MHz Channel Bandwidth
ACPR @ 5 MHz Offset — -40.5 dBc @ 3.84 MHz Channel Bandwidth
LATERAL N-CHANNEL
RF POWER MOSFETs
• Capable of Handling 10:1 VSWR, @ 28 Vdc, 2390 MHz, 100 Watts CW
Output Power
• Characterized with Series Equivalent Large-Signal Impedance Parameters
• Internally Matched for Ease of Use
• Qualified Up to a Maximum of 32 VDD Operation
• Integrated ESD Protection
• Lower Thermal Resistance Package
CASE 465-06, STYLE 1
NI-780
• Designed for Lower Memory Effects and Wide Instantaneous Bandwidth
Applications
MRF6S23100HR3
• Low Gold Plating Thickness on Leads, 40µ″ Nominal.
• Pb-Free and RoHS Compliant
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
CASE 465A-06, STYLE 1
NI-780S
MRF6S23100HSR3
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Vdc
Vdc
Drain-Source Voltage
Gate-Source Voltage
V
-0.5, +68
-0.5, +12
DSS
V
GS
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
330
1.9
W
W/°C
C
D
Storage Temperature Range
Operating Junction Temperature
CW Operation
T
- 65 to +150
200
°C
°C
W
stg
T
J
CW
100
Table 2. Thermal Characteristics
(1,2)
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
Case Temperature 80°C, 100 W CW
Case Temperature 75°C, 20 W CW
R
θ
JC
°C/W
0.53
0.59
1. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access
the MTTF calculators by product.
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
Freescale Semiconductor, Inc., 2005. All rights reserved.
MRF6S23100HR3 MRF6S23100HSR3
RF Device Data
Freescale Semiconductor
1