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MRF21045LR3_08 PDF预览

MRF21045LR3_08

更新时间: 2024-09-13 10:47:31
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 晶体晶体管功率场效应晶体管射频
页数 文件大小 规格书
11页 472K
描述
RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

MRF21045LR3_08 数据手册

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Document Number: MRF21045  
Rev. 12, 10/2008  
Freescale Semiconductor  
Technical Data  
RF Power Field Effect Transistors  
N--Channel Enhancement--Mode Lateral MOSFETs  
Designed for W--CDMA base station applications with frequencies from 2110  
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-  
tions. To be used in Class AB for PCN--PCS/cellular radio and WLL  
applications.  
MRF21045LR3  
MRF21045LSR3  
Typical 2--carrier W--CDMA Performance for VDD = 28 Volts, IDQ = 500 mA,  
f = 2157.5 MHz, Channel Bandwidth = 3.84 MHz, Adjacent Channels  
measured over 3.84 MHz Bandwidth at f1 --5 MHz and f2 +5 MHz,  
Distortion Products measured over a 3.84 MHz Bandwidth at f1 --10 MHz  
and f2 +10 MHz, Peak/Avg. = 8.3 dB @ 0.01% Probability on CCDF.  
Output Power — 10 Watts Avg.  
2110--2170 MHz, 45 W, 28 V  
LATERAL N--CHANNEL  
RF POWER MOSFETs  
Efficiency — 23.5%  
Gain — 15 dB  
IM3 — --37.5 dBc  
ACPR — --41 dBc  
Capable of Handling 5:1 VSWR, @ 28 Vdc, 2140 MHz, 45 Watts CW  
Output Power  
Features  
Internally Matched for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
Designed for Maximum Gain and Insertion Phase Flatness  
Excellent Thermal Stability  
Characterized with Series Equivalent Large--Signal Impedance Parameters  
Low Gold Plating Thickness on Leads, 40µ″ Nominal.  
RoHS Compliant  
CASE 465E--04, STYLE 1  
NI--400  
MRF21045LR3  
In Tape and Reel. R3 Suffix = 250 Units per 32 mm, 13 Inch Reel.  
CASE 465F--04, STYLE 1  
NI--400S  
MRF21045LSR3  
Table 1. Maximum Ratings  
Rating  
Symbol  
Value  
Unit  
Vdc  
Vdc  
Drain--Source Voltage  
Gate--Source Voltage  
V
--0.5, +65  
--0.5, +15  
DSS  
V
GS  
Total Device Dissipation @ T = 25°C  
P
105  
W
C
D
Derate above 25°C  
0.60  
W/°C  
Storage Temperature Range  
Case Operating Temperature  
Operating Junction Temperature  
T
--65 to +150  
150  
°C  
°C  
°C  
stg  
T
C
T
200  
J
Table 2. Thermal Characteristics  
(1)  
Characteristic  
Thermal Resistance, Junction to Case  
Table 3. ESD Protection Characteristics  
Test Conditions  
Symbol  
Value  
Unit  
R
θ
JC  
1.65  
°C/W  
Class  
Human Body Model  
Machine Model  
1 (Minimum)  
M2 (Minimum)  
1. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes -- AN1955.  
Freescale Semiconductor, Inc., 2008. All rights reserved.  

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