Document Number: MRF21060
Rev. 9, 5/2006
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
Designed for PCN and PCS base station applications with frequencies from
2100 to 2200 MHz. Suitable for W - CDMA, CDMA, TDMA, GSM and
multicarrier amplifier applications.
MRF21060LR3
MRF21060LSR3
• Typical 2-Carrier W-CDMA Performance: VDD = 28 Volts, IDQ = 500 mA,
P
out = 6 Watts Avg., Full Frequency Band, Channel Bandwidth = 3.84
MHz, PAR = 8.5 dB @ 0.01% Probability on CCDF.
Power Gain — 12.5 dB
2110-2170 MHz, 60 W, 28 V
LATERAL N-CHANNEL
RF POWER MOSFETs
Drain Efficiency — 15%
ACPR @ 5 MHz Offset — -47 dBc in 3.84 MHz Channel Bandwidth
• Capable of Handling 10:1 VSWR, @ 28 Vdc, 2140 MHz, 60 Watts CW
Output Power
Features
• Internally Matched for Ease of Use
• High Gain, High Efficiency and High Linearity
• Integrated ESD Protection
• Designed for Maximum Gain and Insertion Phase Flatness
• Excellent Thermal Stability
• Characterized with Series Equivalent Large-Signal Impedance Parameters
CASE 465-06, STYLE 1
NI-780
MRF21060LR3
• Available with Low Gold Plating Thickness on Leads. L Suffix Indicates
40μ″ Nominal.
• RoHS Compliant
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 Inch Reel.
CASE 465A-06, STYLE 1
NI-780S
MRF21060LSR3
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Vdc
Vdc
Drain-Source Voltage
Gate-Source Voltage
V
DSS
-0.5, +65
-0.5, +15
V
GS
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
180
0.98
W
W/°C
C
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
T
- 65 to +150
150
°C
°C
°C
stg
T
C
T
200
J
Table 2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
1.02
°C/W
θ
JC
Table 3. ESD Protection Characteristics
Test Conditions
Class
Human Body Model
Machine Model
2 (Minimum)
M3 (Minimum)
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MRF21060LR3 MRF21060LSR3
RF Device Data
Freescale Semiconductor
1