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MRF21085 PDF预览

MRF21085

更新时间: 2024-11-05 05:50:11
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飞思卡尔 - FREESCALE 晶体晶体管功率场效应晶体管射频放大器局域网
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12页 388K
描述
RF Power Field Effect Transistors

MRF21085 数据手册

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Document Number: MRF21085  
Rev. 9, 5/2006  
Freescale Semiconductor  
Technical Data  
RF Power Field Effect Transistors  
N-Channel Enhancement-Mode Lateral MOSFETs  
MRF21085LR3  
MRF21085LSR3  
Designed for W-CDMA base station applications with frequencies from 2110  
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-  
tions. To be used in Class AB for PCN - PCS/cellular radio and WLL  
applications.  
Typical 2-Carrier W-CDMA Performance: VDD = 28 Volts, IDQ = 1000 mA,  
Pout = 19 Watts Avg., Full Frequency Band, Channel Bandwidth = 3.84  
MHz, Peak/Avg. = 8.5 dB @ 0.01% Probability on CCDF.  
Power Gain — 13.6 dB  
2110-2170 MHz, 90 W, 28 V  
LATERAL N-CHANNEL  
RF POWER MOSFETs  
Drain Efficiency — 23%  
IM3 @ 10 MHz Offset — -37.5 dBc in 3.84 MHz Channel Bandwidth  
ACPR @ 5 MHz Offset — -41 dBc in 3.84 MHz Channel Bandwidth  
Capable of Handling 5:1 VSWR, @ 28 Vdc, 2140 MHz, 90 Watts CW  
Output Power  
Features  
Internally Matched for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
CASE 465-06, STYLE 1  
NI-780  
Designed for Maximum Gain and Insertion Phase Flatness  
Excellent Thermal Stability  
MRF21085LR3  
Characterized with Series Equivalent Large-Signal Impedance Parameters  
Available with Low Gold Plating Thickness on Leads. L Suffix Indicates  
40μ″ Nominal.  
RoHS Compliant  
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.  
CASE 465A-06, STYLE 1  
NI-780S  
MRF21085LSR3  
Table 1. Maximum Ratings  
Rating  
Symbol  
Value  
Unit  
Vdc  
Vdc  
Drain-Source Voltage  
Gate-Source Voltage  
V
DSS  
-0.5, +65  
-0.5, +15  
V
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
224  
1.28  
W
W/°C  
C
Storage Temperature Range  
Case Operating Temperature  
Operating Junction Temperature  
T
- 65 to +150  
150  
°C  
°C  
°C  
stg  
T
C
T
200  
J
Table 2. Thermal Characteristics  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
0.78  
°C/W  
θ
JC  
Table 3. ESD Protection Characteristics  
Test Conditions  
Class  
Human Body Model  
Machine Model  
1 (Minimum)  
M3 (Minimum)  
© Freescale Semiconductor, Inc., 2006. All rights reserved.  

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