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MRF21045SR3 PDF预览

MRF21045SR3

更新时间: 2024-11-05 15:44:19
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
12页 389K
描述
RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, NI-400S, CASE 465F-04, 2 PIN

MRF21045SR3 数据手册

 浏览型号MRF21045SR3的Datasheet PDF文件第2页浏览型号MRF21045SR3的Datasheet PDF文件第3页浏览型号MRF21045SR3的Datasheet PDF文件第4页浏览型号MRF21045SR3的Datasheet PDF文件第5页浏览型号MRF21045SR3的Datasheet PDF文件第6页浏览型号MRF21045SR3的Datasheet PDF文件第7页 
ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF21045/D  
The RF MOSFET Line  
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
N–Channel Enhancement–Mode Lateral MOSFETs  
ꢒꢀ ꢁ ꢖꢗꢘꢙꢚ ꢜꢀꢛ  
Designed for W–CDMA base station applications with frequencies from 2110  
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-  
tions. To be used in Class AB for PCN–PCS/cellular radio and WLL  
applications.  
Typical 2–carrier W–CDMA Performance for VDD = 28 Volts, IDQ = 500 mA,  
f1 = 2135 MHz, f2 = 2145 MHz, Channel Bandwidth = 3.84 MHz,  
Adjacent Channels measured over 3.84 MHz Bandwidth at f1 –5 MHz  
and f2 +5 MHz, Distortion Products measured over a 3.84 MHz Bandwidth  
at f1 –10 MHz and f2 +10 MHz, Peak/Avg. = 8.3 dB @ 0.01% Probability  
on CCDF.  
2170 MHz, 45 W, 28 V  
LATERAL N–CHANNEL  
RF POWER MOSFETs  
Output Power — 10 Watts Avg.  
Efficiency — 23.5%  
Gain — 15 dB  
IM3 — –37.5 dBc  
ACPR — –41 dBc  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
CASE 465E–04, STYLE 1  
NI–400  
MRF21045R3  
Designed for Maximum Gain and Insertion Phase Flatness  
Capable of Handling 5:1 VSWR, @ 28 Vdc, 2170 MHz, 45 Watts CW  
Output Power  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
In Tape and Reel. R3 Suffix = 250 Units per 32 mm, 13 Inch Reel.  
CASE 465F–04, STYLE 1  
NI–400S  
MRF21045SR3  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
–0.5, +15  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
105  
0.60  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
Machine Model  
1 (Minimum)  
M2 (Minimum)  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
1.65  
°C/W  
θ
JC  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 6  
Motorola, Inc. 2003  

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