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MRF174 PDF预览

MRF174

更新时间: 2024-11-04 22:45:59
品牌 Logo 应用领域
泰科 - TE 晶体晶体管射频放大器局域网
页数 文件大小 规格书
9页 178K
描述
N-CHANNEL MOS BROADBAND RF POWER FET

MRF174 技术参数

是否Rohs认证: 符合生命周期:Transferred
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.36
Is Samacsys:N配置:SINGLE
最小漏源击穿电压:65 V最大漏极电流 (ID):13 A
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:VERY HIGH FREQUENCY BAND
JESD-30 代码:O-CRFM-F4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:ROUND
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:NO端子形式:FLAT
端子位置:RADIAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF174 数据手册

 浏览型号MRF174的Datasheet PDF文件第2页浏览型号MRF174的Datasheet PDF文件第3页浏览型号MRF174的Datasheet PDF文件第4页浏览型号MRF174的Datasheet PDF文件第5页浏览型号MRF174的Datasheet PDF文件第6页浏览型号MRF174的Datasheet PDF文件第7页 
Order this document  
SEMICONDUCTOR TECHNICAL DATA  
by MRF174/D  
The RF MOSFET Line  
N–Channel Enhancement–Mode  
Designed primarily for wideband large–signal output and driver stages up to  
200 MHz frequency range.  
Guaranteed Performance at 150 MHz, 28 Vdc  
Output Power = 125 Watts  
Minimum Gain = 9.0 dB  
Efficiency = 50% (Min)  
Excellent Thermal Stability, Ideally Suited For Class A  
Operation  
125 W, to 200 MHz  
N–CHANNEL MOS  
BROADBAND RF POWER  
FET  
Facilitates Manual Gain Control, ALC and Modulation  
Techniques  
100% Tested For Load Mismatch At All Phase Angles  
With 30:1 VSWR  
Low Noise Figure — 3.0 dB Typ at 2.0 A, 150 MHz  
D
G
S
CASE 211–11, STYLE 2  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Drain–Gate Voltage  
V
DSS  
V
DGR  
65  
(R  
= 1.0 M)  
GS  
Gate–Source Voltage  
V
±40  
Vdc  
Adc  
GS  
Drain Current — Continuous  
I
13  
D
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
270  
1.54  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.65  
°C/W  
θJC  
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 7  
1

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