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MMDF6N02HDR2 PDF预览

MMDF6N02HDR2

更新时间: 2024-09-15 21:13:51
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 开关光电二极管晶体管
页数 文件大小 规格书
10页 193K
描述
6500mA, 20V, 2 CHANNEL, N-CHANNEL, Si, SMALL SIGNAL, MOSFET

MMDF6N02HDR2 技术参数

生命周期:Transferred包装说明:SMALL OUTLINE, R-PDSO-G8
Reach Compliance Code:unknown风险等级:5.37
其他特性:LOGIC LEVEL COMPATIBLE配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):6.5 A
最大漏极电流 (ID):6.5 A最大漏源导通电阻:0.035 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):178 pF
JESD-30 代码:R-PDSO-G8JESD-609代码:e0
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
功耗环境最大值:2 W最大功率耗散 (Abs):2 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

MMDF6N02HDR2 数据手册

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Order this document  
by MMDF6N02HD/D  
SEMICONDUCTOR TECHNICAL DATA  
Medium Power Surface Mount Products  
Motorola Preferred Device  
DUAL TMOS  
POWER MOSFET  
6.0 AMPERES  
20 VOLTS  
Dual HDTMOS devices are an advanced series of power  
MOSFETs which utilize Motorola’s High Cell Density TMOS  
process. These miniature surface mount MOSFETs feature low  
R
= 0.035 OHM  
DS(on)  
R
and true logic level performance. Dual HDTMOS devices  
DS(on)  
are designed for use in low voltage, high speed switching  
applications where power efficiency is important. Typical applica-  
tions are dc–dc converters, and power management in portable  
and battery powered products such as computers, printers, cellular  
and cordless phones. They can also be used for low voltage motor  
controls in mass storage products such as disk drives and tape  
drives.  
D
CASE 751–05, Style 11  
SO–8  
Low R Provides Higher Efficiency and Extends Battery Life  
DS(on)  
G
Logic Level Gate Drive — Can Be Driven by Logic ICs  
Miniature SO–8 Surface Mount Package — Saves Board Space  
Diode Is Characterized for Use In Bridge Circuits  
Diode Exhibits High Speed, With Soft Recovery  
S
1
2
3
4
8
7
6
5
Drain–1  
Drain–1  
Drain–2  
Drain–2  
Source–1  
Gate–1  
I
Specified at Elevated Temperature  
DSS  
Mounting Information for SO–8 Package Provided  
Source–2  
Gate–2  
Top View  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
20  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
Drain–to–Source Voltage  
V
DSS  
Drain–to–Gate Voltage (R  
GS  
= 1.0 M)  
V
DGR  
20  
Gate–to–Source Voltage — Continuous  
Drain Current — Continuous @ T = 25°C  
Drain Current — Continuous @ T = 70°C  
V
GS  
± 12  
I
I
6.5  
6.0  
52  
A
A
D
D
Drain Current — Single Pulse (t 10 µs)  
I
Apk  
Watts  
°C  
p
DM  
(1)  
Total Power Dissipation @ T = 25°C  
P
D
2.0  
– 55 to 150  
62.5  
A
Operating and Storage Temperature Range  
Thermal Resistance — Junction to Ambient  
Maximum Lead Temperature for Soldering Purposes  
DEVICE MARKING  
T , T  
J
stg  
R
°C/W  
°C  
θJA  
T
L
260  
D6N02H  
(1) Mounted on 1” square FR4 or G–10 board (V  
= 4.5 V, @ 10 seconds).  
GS  
ORDERING INFORMATION  
Device  
Reel Size  
Tape Width  
Quantity  
MMDF6N02HDR2  
13″  
12mm embossed tape  
2500  
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Designer’s and HDTMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a trademark of  
the Bergquist Company.  
REV 1  
Motorola, Inc. 1997  

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