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MMDJ3N03BJT PDF预览

MMDJ3N03BJT

更新时间: 2024-11-08 22:13:55
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率双极晶体管光电二极管
页数 文件大小 规格书
4页 126K
描述
DUAL BIPOLAR POWER TRANSISTOR NPN SILICON 30 VOLTS 3 AMPERES

MMDJ3N03BJT 技术参数

生命周期:Transferred零件包装代码:SOIC
包装说明:SMALL OUTLINE, R-PDSO-G8针数:8
Reach Compliance Code:unknown风险等级:5.46
Is Samacsys:N最大集电极电流 (IC):3 A
集电极-发射极最大电压:30 V配置:SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE):60JESD-30 代码:R-PDSO-G8
JESD-609代码:e0元件数量:2
端子数量:8最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:NPN
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
晶体管元件材料:SILICON标称过渡频率 (fT):100 MHz
Base Number Matches:1

MMDJ3N03BJT 数据手册

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Order this document  
by MMDJ3N03BJT/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
SO–8 for Surface Mount Applications  
Designed for general purpose amplifier and low speed switching applications.  
DUAL BIPOLAR  
POWER TRANSISTOR  
NPN SILICON  
Collector –Emitter Sustaining Voltage — V  
CEO(sus)  
= 30 Vdc (Min) @ I = 10 mAdc  
C
30 VOLTS  
3 AMPERES  
High DC Current Gain — h  
FE  
= 100 Vdc (Min) @ I = 1.0 Adc  
C
= 90 Vdc (Min) @ I = 3.0 Adc  
C
Low Collector –Emitter Saturation Voltage — V  
CE(sat)  
= 0.235 Vdc (Max) @ I = 1.2 Adc  
C
= 0.5 Vdc (Max) @ I = 5.0 Adc  
C
Miniature SO–8 Surface Mount Package – Saves Board Space  
CASE 751–05, Style 16  
(SO–8)  
C
C
E
B
E
1
2
3
4
8
7
6
5
Collector–1  
Collector–1  
Collector–2  
Collector–2  
Emitter–1  
Base–1  
B
Emitter–2  
Base–2  
Schematic  
MARKING: 3N3BJT  
ENG  
Top View  
Pinout  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector–Base Voltage  
Symbol  
Value  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
V
CB  
45  
30  
Collector–Emitter Voltage  
Emitter–Base Voltage  
V
CEO  
V
EB  
± 8.0  
Collector Current — Continuous  
Collector Current — Peak  
I
C
3.0  
5.0  
Base Current — Continuous  
I
1.0  
Adc  
C
B
Operating and Storage Junction Temperature Range  
T , T  
55 to +150  
J
stg  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
(1)  
Thermal Resistance – Junction to Ambient  
R
62.5  
C/W  
θJA  
(1)  
Total Power Dissipation @ T = 25 C  
A
Derate above 25 C  
P
D
2.0  
16  
Watts  
mW/ C  
Maximum Temperature for Soldering  
T
L
260  
C
(1) Mounted on 2” sq. FR–4 board (1” sq. 2 oz. Cu 0.06” thick single sided) with one die operating, 10 seconds max.  
This document contains information on a new product. Specifications and information are subject to change without notice.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 1  
Motorola, Inc. 1996

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