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MMDF6N03HDR2 PDF预览

MMDF6N03HDR2

更新时间: 2024-09-15 12:29:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
10页 236K
描述
Power MOSFET 6 Amps, 30 Volts

MMDF6N03HDR2 数据手册

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MMDF6N03HD  
Preferred Device  
Power MOSFET  
6 Amps, 30 Volts  
NChannel SO8, Dual  
These miniature surface mount MOSFETs feature low R  
and  
DS(on)  
true logic level performance. Dual MOSFET devices are designed for  
use in low voltage, high speed switching applications where power  
efficiency is important. Typical applications are dcdc converters, and  
power management in portable and battery powered products such as  
computers, printers, cellular and cordless phones. They can also be  
used for low voltage motor controls in mass storage products such as  
disk drives and tape drives.  
http://onsemi.com  
6 AMPERES  
30 VOLTS  
RDS(on) = 35 mW  
Low R  
Provides Higher Efficiency and Extends Battery Life  
DS(on)  
NChannel  
Logic Level Gate Drive Can Be Driven by Logic ICs  
Miniature SO8 Surface Mount Package Saves Board Space  
Diode Is Characterized for Use In Bridge Circuits  
Diode Exhibits High Speed, With Soft Recovery  
D
D
I  
Specified at Elevated Temperature  
G
G
DSS  
Mounting Information for SO8 Package Provided  
S
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING  
DIAGRAM  
Rating  
Symbol  
Value  
30  
Unit  
Vdc  
Vdc  
DraintoSource Voltage  
V
DSS  
GatetoSource Voltage Continuous  
V
± 20  
GS  
Drain Current Continuous @ T = 25°C  
I
6.0  
30  
Adc  
Apk  
A
D
SO8, Dual  
CASE 751  
STYLE 11  
Drain Current Single Pulse (t 10 μs)  
I
D6N03  
LYWW  
p
DM  
8
Source Current Continuous @ T = 25°C  
I
1.7  
2.0  
Adc  
A
S
Total Power Dissipation @ T = 25°C  
P
Watts  
A
D
1
(Note 1.)  
Operating and Storage Temperature Range  
T , T  
55 to  
°C  
D6N03  
= Device Code  
J
stg  
150  
L
Y
WW  
= Location Code  
= Year  
= Work Week  
Single Pulse DraintoSource Avalanche  
E
325  
mJ  
AS  
Energy Starting T = 25°C  
J
(V = 30 Vdc, V = 5.0 Vdc,  
DD  
GS  
V
= 20 Vdc, I = 9.0 Apk,  
DS  
L
PIN ASSIGNMENT  
L = 10 mH, R = 25 W)  
G
Thermal Resistance JunctiontoAmbient  
R
62.5  
260  
°C/W  
°C  
θ
JA  
Source1  
Gate1  
Drain1  
Drain1  
Drain2  
1
2
3
4
8
7
6
5
Maximum Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 sec.  
T
L
Source2  
1. Mounted on G10/FR4 glass epoxy board using minimum recommended  
footprint.  
Gate2  
Drain2  
Top View  
ORDERING INFORMATION  
Device  
MMDF6N03HDR2  
Package  
Shipping  
2500 Tape & Reel  
SO8  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
August, 2006 Rev. 4  
MMDF6N03HD/D  
 

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