是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | PLASTIC, FBGA-96 |
针数: | 96 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.74 | 最长访问时间: | 80 ns |
备用内存宽度: | 16 | 启动块: | BOTTOM/TOP |
JESD-30 代码: | R-PBGA-B96 | JESD-609代码: | e1 |
长度: | 14.5 mm | 内存密度: | 134217728 bit |
内存集成电路类型: | FLASH | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 96 |
字数: | 4194304 words | 字数代码: | 4000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 4MX32 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.1 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
类型: | NOR TYPE | 宽度: | 9.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MBM29XL12DF80PFV | FUJITSU |
获取价格 |
Flash, 4MX32, 80ns, PDSO90, PLASTIC, SSOP-90 | |
MBM29XL12DF80PFV | SPANSION |
获取价格 |
Flash, 4MX32, 80ns, PDSO90, PLASTIC, SSOP-90 | |
MBM29XL12DF80PFV-E1 | SPANSION |
获取价格 |
Flash, 4MX32, 80ns, PDSO90, PLASTIC, SSOP-90 | |
MBM300A6 | HITACHI |
获取价格 |
IGBT MODULE RANGE WITH SOFT AND FAST (SFD) FREE-WHEELING DIODES | |
MBM300GR12 | RENESAS |
获取价格 |
IGBT | |
MBM300GR12A | RENESAS |
获取价格 |
300A, 1200V, N-CHANNEL IGBT | |
MBM300GR12A | HITACHI |
获取价格 |
Insulated Gate Bipolar Transistor, 300A I(C), 1200V V(BR)CES, N-Channel, | |
MBM300GR6 | HITACHI |
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Insulated Gate Bipolar Transistor, 300A I(C), 600V V(BR)CES, N-Channel, | |
MBM300GR6 | RENESAS |
获取价格 |
300A, 600V, N-CHANNEL IGBT | |
MBM300GS12AW | HITACHI |
获取价格 |
Insulated Gate Bipolar Transistor, 300A I(C), 1200V V(BR)CES |