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MBM29XL12DF80PBT-E1 PDF预览

MBM29XL12DF80PBT-E1

更新时间: 2024-11-19 15:45:35
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
96页 596K
描述
Flash, 4MX32, 80ns, PBGA96, PLASTIC, FBGA-96

MBM29XL12DF80PBT-E1 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:PLASTIC, FBGA-96
针数:96Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.74最长访问时间:80 ns
备用内存宽度:16启动块:BOTTOM/TOP
JESD-30 代码:R-PBGA-B96JESD-609代码:e1
长度:14.5 mm内存密度:134217728 bit
内存集成电路类型:FLASH内存宽度:32
功能数量:1端子数量:96
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX32
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.1 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
类型:NOR TYPE宽度:9.5 mm
Base Number Matches:1

MBM29XL12DF80PBT-E1 数据手册

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MBM29XL12DF-70/80  
Data Sheet (Retired Product)  
MBM29XL12DF-70/80Cover Sheet  
This product has been retired and is not recommended for new designs. Availability of this document is retained for reference  
and historical purposes only.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number MBM29XL12DF  
Revision DS05-20901-2E  
Issue Date July 31, 2007  

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