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IXGX50N60AU1S PDF预览

IXGX50N60AU1S

更新时间: 2024-11-04 23:14:55
品牌 Logo 应用领域
IXYS 二极管双极性晶体管
页数 文件大小 规格书
6页 194K
描述
HiPerFAST IGBT with Diode

IXGX50N60AU1S 技术参数

生命周期:Obsolete零件包装代码:TO-247SMD
包装说明:TO-247SMD, 3 PIN针数:3
Reach Compliance Code:unknown风险等级:5.68
外壳连接:COLLECTOR最大集电极电流 (IC):75 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
最大降落时间(tf):400 ns门极发射器阈值电压最大值:5.5 V
门极-发射极最大电压:20 VJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):300 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:MOTOR CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):280 ns
标称接通时间 (ton):50 nsBase Number Matches:1

IXGX50N60AU1S 数据手册

 浏览型号IXGX50N60AU1S的Datasheet PDF文件第2页浏览型号IXGX50N60AU1S的Datasheet PDF文件第3页浏览型号IXGX50N60AU1S的Datasheet PDF文件第4页浏览型号IXGX50N60AU1S的Datasheet PDF文件第5页浏览型号IXGX50N60AU1S的Datasheet PDF文件第6页 
Preliminary data  
HiPerFASTTM  
IGBT with Diode  
VCES  
IC25  
= 600 V  
= 75 A  
IXGX50N60AU1  
IXGX50N60AU1S  
VCE(sat) = 2.7 V  
tfi = 275 ns  
Combi Pack  
TO-247 Hole-less SMD  
(50N60AU1S)  
Symbol  
TestConditions  
Maximum Ratings  
TAB)  
G
VCES  
VCGR  
TJ = 25°C to 150°C  
600  
600  
V
V
E
TJ = 25°C to 150°C; RGE = 1 MΩ  
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
TO-247 Hole-less  
(50N60AU1)  
IC25  
IC90  
ICM  
TC = 25°C, limited by leads  
TC = 90°C  
75  
50  
A
A
A
C (TAB)  
TC = 25°C, 1 ms  
200  
G
C
SSOA  
(RBSOA)  
VGE= 15 V, TVJ = 125°C, RG = 10 Ω  
Clamped inductive load, L = 30 µH  
ICM = 100  
@ 0.8 VCES  
A
G = Gate,  
E = Emitter,  
C = Collector,  
TAB = Collector  
PC  
TC = 25°C  
300  
W
Features  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
l
Hole-less TO-247 for clip mount  
High current capability  
High frequency IGBT and anti-  
parallel FRED in one package  
Low VCE(sat)  
TJM  
Tstg  
l
l
-55 ... +150  
Weight  
6
g
l
- for minimum on-state conduction  
losses  
MOS Gate turn-on  
- drive simplicity  
Fast RecoveryEpitaxial Diode (FRED)  
- soft recovery with low IRM  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
l
l
Applications  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
l
AC motor speed control  
DC servo and robot drives  
DC choppers  
Uninterruptible power supplies (UPS)  
l
l
l
BVCES  
VGE(th)  
IC = 500 µA, VGE = 0 V  
IC = 500 µA, VCE = VGE  
600  
2.5  
V
l
Switch-mode and resonant-mode  
5.5  
V
power supplies  
ICES  
VCE = 0.8 • VCES  
VGE = 0 V  
TJ = 25°C  
TJ = 125°C  
250  
15 mA  
µA  
Advantages  
l
Space savings (two devices in one  
IGES  
VCE = 0 V, VGE = ±20 V  
±100  
2.7  
nA  
V
package)  
Reduces assembly time and cost  
High power density  
l
VCE(sat)  
IC = IC90, VGE = 15 V  
l
© 1997 IXYS All rights reserved  
97513 (5/97)  

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