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IXGP12N60U1 PDF预览

IXGP12N60U1

更新时间: 2024-11-19 21:55:11
品牌 Logo 应用领域
IXYS 二极管双极性晶体管
页数 文件大小 规格书
6页 101K
描述
Low VCE(sat) IGBT with Diode Combi Pack

IXGP12N60U1 技术参数

生命周期:Obsolete包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknown风险等级:5.82
外壳连接:COLLECTOR最大集电极电流 (IC):24 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
最大降落时间(tf):500 ns门极发射器阈值电压最大值:5.5 V
门极-发射极最大电压:20 VJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:100 W最大功率耗散 (Abs):100 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):1000 ns
标称接通时间 (ton):300 nsVCEsat-Max:2.5 V
Base Number Matches:1

IXGP12N60U1 数据手册

 浏览型号IXGP12N60U1的Datasheet PDF文件第2页浏览型号IXGP12N60U1的Datasheet PDF文件第3页浏览型号IXGP12N60U1的Datasheet PDF文件第4页浏览型号IXGP12N60U1的Datasheet PDF文件第5页浏览型号IXGP12N60U1的Datasheet PDF文件第6页 
Preliminary data  
VCES  
IC  
VCE(sat)  
= 600 V  
24 A  
= 2.5 V  
IXGP12N60U1  
Low VCE(sat)  
=
IGBT with Diode  
Combi Pack  
Symbol  
TestConditions  
Maximum Ratings  
TO-220 AB  
VCES  
VCGR  
TJ = 25°C to 150°C  
600  
600  
V
V
TJ = 25°C to 150°C; RGE = 1 MΩ  
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
G
C
E
IC25  
IC90  
ICM  
TC = 25°C  
24  
12  
48  
A
A
A
TC = 90°C  
G = Gate,  
E = Emitter,  
C = Collector,  
TAB = Collector  
TC = 25°C, 1 ms  
SSOA  
VGE= 15 V, TVJ = 125°C, RG = 150 Ω  
ICM = 20  
A
(RBSOA)  
Clamped inductive load, L = 300 µH  
@ 0.8 VCES  
PC  
TC = 25°C  
100  
W
Features  
International standard package  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
l
TJM  
Tstg  
JEDEC TO-220 AB  
l
IGBT with antiparallel FRED in one  
package  
-55 ... +150  
2nd generation HDMOSTM process  
Low VCE(sat)  
Md  
Mounting torque with screw M3  
Mounting torque with screw M3.5  
0.45/4 Nm/lb.in.  
0.55/5 Nm/lb.in.  
l
l
- for minimum on-state conduction  
losses  
MOS Gate turn-on  
- drive simplicity  
FastRecovery Epitaxial Diode FRED)  
- soft recovery with low IRM  
Weight  
4
g
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
l
l
Applications  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
l
AC motor speed control  
DC servo and robot drives  
DC choppers  
Uninterruptible power supplies (UPS)  
l
l
l
BVCES  
VGE(th)  
IC = 750 µA, VGE = 0 V  
IC = 250 µA, VGE = VGE  
600  
2.5  
V
V
l
Switch-mode and resonant-mode  
5.5  
power supplies  
ICES  
VCE = 0.8 • VCES  
VGE = 0 V  
TJ = 25°C  
TJ = 125°C  
250 µA  
2.5 mA  
Advantages  
l
Easy to mount with 1 screw  
Space savings (two devices in one  
l
IGES  
VCE = 0 V, VGE = ±20 V  
±100 nA  
package)  
Reduces assembly time and cost  
High power density  
l
VCE(sat)  
IC = ICE90, VGE = 15 V  
2.5  
V
l
© 1996 IXYS All rights reserved  
92792D(9/96)  

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