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IXGP16N60B2D1 PDF预览

IXGP16N60B2D1

更新时间: 2024-11-20 12:20:15
品牌 Logo 应用领域
IXYS 二极管双极性晶体管
页数 文件大小 规格书
7页 222K
描述
HiPerFAST IGBTs B2-Class High Speed w/ Diode

IXGP16N60B2D1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-220AB
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliant风险等级:5.81
外壳连接:COLLECTOR最大集电极电流 (IC):40 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:5.5 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):150 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子面层:Pure Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):280 ns标称接通时间 (ton):43 ns
Base Number Matches:1

IXGP16N60B2D1 数据手册

 浏览型号IXGP16N60B2D1的Datasheet PDF文件第2页浏览型号IXGP16N60B2D1的Datasheet PDF文件第3页浏览型号IXGP16N60B2D1的Datasheet PDF文件第4页浏览型号IXGP16N60B2D1的Datasheet PDF文件第5页浏览型号IXGP16N60B2D1的Datasheet PDF文件第6页浏览型号IXGP16N60B2D1的Datasheet PDF文件第7页 
HiPerFASTTM IGBTs  
B2-Class High Speed  
w/ Diode  
VCES = 600V  
IC110 = 16A  
VCE(sat) 2.3V  
tfi(typ) = 70ns  
IXGA16N60B2D1  
IXGP16N60B2D1  
IXGH16N60B2D1  
TO-263 AA (IXGA)  
G
E
C (Tab)  
Symbol  
Test Conditions  
Maximum Ratings  
TO-220AB (IXGP)  
VCES  
VCGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C, RGE = 1MΩ  
600  
600  
V
V
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
G
C
C (Tab)  
E
IC25  
TC = 25°C  
40  
A
IC110  
IF110  
TC = 110°C  
TC = 110°C  
16  
11  
A
A
TO-247 (IXGH)  
ICM  
TC = 25°C, 1ms  
100  
A
SSOA  
VGE= 15V, TJ = 125°C, RG = 22Ω  
ICM = 32  
A
(RBSOA)  
Clamped Inductive load  
VCE VCES  
G
PC  
TC = 25°C  
150  
W
C
C (Tab)  
E
TJ  
TJM  
Tstg  
-55 ... +150  
150  
°C  
°C  
°C  
G = Gate  
E = Emitter  
C
= Collector  
Tab = Collector  
-55 ... +150  
Md  
FC  
Mounting Torque (TO-220 & TO-247)  
Mounting Force (TO-263)  
1.13/10  
10..65 / 2.2..14.6  
Nm/lb.in.  
N/lb.  
Features  
TL  
TSOLD  
Maximum Lead Temperature for Soldering  
1.6mm (0.062 in.) from Case for 10s  
300  
260  
°C  
°C  
z
Optimized for Low Conduction and  
Switching Losses  
Square RBSOA  
Anti-Parallel Ultra Fast Diode  
International Standard Packages  
z
z
z
Weight  
TO-263  
TO-220  
TO-247  
2.5  
3.0  
6.0  
g
g
g
Advantages  
z
High Power Density  
Low Gate Drive Requirement  
z
Symbol  
Test Conditions  
Characteristic Values  
(TJ = 25°C, Unless Otherwise Specified)  
Min.  
Typ.  
Max.  
Applications  
VGE(th)  
ICES  
IC = 250μA, VCE = VGE  
3.0  
5.5  
V
z
Power Inverters  
UPS  
VCE = VCES,VGE = 0V  
25 μA  
1 mA  
z
TJ = 125°C  
TJ = 125°C  
z
z
z
z
z
z
Motor Drives  
SMPS  
PFC Circuits  
Battery Chargers  
Welding Machines  
Lamp Ballasts  
IGES  
VCE = 0V, VGE = ±20V  
±100 nA  
VCE(sat)  
IC = 12A, VGE = 15V, Note1  
2.30  
V
V
1.65  
DS99178B(08/10)  
© 2010 IXYS CORPORATION, All Rights Reserved  

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