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IXGP20N120BD1 PDF预览

IXGP20N120BD1

更新时间: 2024-11-20 14:51:43
品牌 Logo 应用领域
力特 - LITTELFUSE 局域网功率控制晶体管
页数 文件大小 规格书
6页 500K
描述
Insulated Gate Bipolar Transistor, 40A I(C), 1200V V(BR)CES, N-Channel, TO-220AB, TO-220, 3 PIN

IXGP20N120BD1 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5.62外壳连接:COLLECTOR
最大集电极电流 (IC):40 A集电极-发射极最大电压:1200 V
配置:SINGLE WITH BUILT-IN DIODEJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):790 ns标称接通时间 (ton):35 ns
Base Number Matches:1

IXGP20N120BD1 数据手册

 浏览型号IXGP20N120BD1的Datasheet PDF文件第2页浏览型号IXGP20N120BD1的Datasheet PDF文件第3页浏览型号IXGP20N120BD1的Datasheet PDF文件第4页浏览型号IXGP20N120BD1的Datasheet PDF文件第5页浏览型号IXGP20N120BD1的Datasheet PDF文件第6页 
High Voltage IGBT with  
Diode  
Designed for induction  
heating applications  
IXGP 20N120B  
IXGP 20N120BD1  
VCES  
IC25  
= 1200 V  
= 40 A  
VCE(sat) = 3.4 V  
tfi(typ)  
= 160 ns  
D1  
Maximum Ratings  
Symbol  
TestConditions  
TO-220 (IXGP)  
VCES  
VCGR  
TJ = 25°C to 150°C  
1200  
1200  
V
V
TJ = 25°C to 150°C; RGE = 1 MΩ  
VGES  
VGEM  
Continuous  
Transient  
20  
30  
V
V
C (TAB)  
G
C
IC25  
IC110  
ICM  
TC = 25°C  
40  
20  
A
A
A
E
TC = 110°C  
G = Gate  
C = Collector  
TAB = Collector  
TC = 25°C, 1 ms  
100  
E = Emitter  
SSOA  
(RBSOA)  
VGE = 15 V, TJ = 125°C, RG = 10 Ω  
Clamped inductive load  
ICM = 48  
@0.8 VCES  
A
Features  
z International standard TO-220  
package  
PC  
TC = 25°C  
190  
W
z IGBT and anti-parallel FRED for  
resonant power supplies  
- Induction heating  
- Rice cookers  
z MOS Gate turn-on  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
-55 ... +150  
Md  
Mounting torque  
1.13/10 Nm/lb.in.  
- drive simplicity  
z Fast Recovery Expitaxial Diode (FRED)  
- soft recovery with low IRM  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Weight  
4
g
Advantages  
z Saves space (two devices in one  
package)  
z
Easy to mount with 1 screw  
(isolated mounting screw hole)  
Reduces assembly time and cost  
z
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
VGE(th)  
ICES  
IC = 250 µA, VCE = VGE  
2.5  
5.0  
V
VCE = VCES  
VGE = 0 V  
20N120B  
20N120BD1  
25 µA  
50 µA  
IGES  
VCE = 0 V, VGE = 20 V  
100 nA  
VCE(sat)  
IC  
= 20A, VGE = 15 V  
2.9  
2.8  
3.4  
V
V
Note 2  
TJ=125°C  
© 2003 IXYS All rights reserved  
DS99088A(12/03)  

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